IP Library Granted Patent US 9,041,502
Granted Patent B2
US 9,041,502 · App. 13/440,063 · Granted May 26, 2015

Heat dissipating electromagnetic device arrangement

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Quick Facts
Patent No.
US 9,041,502
App. No.
13/440,063
Granted
May 26, 2015
Kind
B2
Abstract

An electromagnetic device arrangement includes a transformer assembly having a core, windings, and a housing disposed around at least a portion of the core and windings. An enclosure at least partially encloses the transformer assembly. The transformer assembly is mounted to a first portion of the enclosure such that heat is transferred from the transformer assembly to the first portion of the enclosure. A second portion of the enclosure has an extension extending therefrom such that the extension is placed in thermal contact with the transformer assembly to transfer heat from the transformer assembly to the extension.

Claims (27)

1. A electromagnetic device arrangement, comprising:

an electromagnetic device including a core, a plurality of windings, and a housing disposed around at least a portion of the core and windings and defining a space therebetween; and

an enclosure at least partially enclosing the electromagnetic device, a first portion of the enclosure having the electromagnetic device mounted thereto such that heat is transferred from the electromagnetic device to the first portion of the enclosure, a second portion of the enclosure having an extension extending therefrom such that the extension is placed in thermal contact with the electromagnetic device such that heat is transferred from the electromagnetic device to the extension.

2. The electromagnetic device arrangement of claim 1 , wherein the first portion of the enclosure is a base and the second portion of the enclosure is a cover connected to the base to form the enclosure.

3. The electromagnetic device arrangement of claim 2 , wherein the extension is placed in thermal contact with the electromagnetic device on a side of the electromagnetic device opposite the base.

4. The electromagnetic device arrangement of claim 1 , wherein the extension is placed in thermal contact with the electromagnetic device such that the extension is in thermal contact with the housing.

5. The electromagnetic device arrangement of claim 1 , wherein the housing includes an opening therein, and the extension is configured to be disposed through the opening such that at least a portion of the extension is in thermal contact with the core without the housing being disposed therebetween.

6. The electromagnetic device arrangement of claim 1 , wherein the extension is placed in thermal contact with the electromagnetic device such that a portion of the extension is in thermal contact with the housing and another portion of the extension is in thermal contact with the core without the housing being disposed therebetween.

7. The electromagnetic device arrangement of claim 1 , further comprising a thermally conductive material disposed between the extension and the electromagnetic device.

8. The electromagnetic device arrangement of claim 1 , wherein the core includes first and second portions connected to each other with an adhesive material, the electromagnetic device being disposed relative to the enclosure such that heat from the first portion of the core transfers substantially to the first portion of the enclosure, and heat from the second portion of the core transfers substantially to the extension.

9. An electrical device, comprising:

an electromagnetic device including a plurality of windings, a split core bonded together with an adhesive material, and a housing disposed at least partially around the windings and the core and defining a space therebetween;

a base plate having the electromagnetic device mounted thereto and in thermal contact therewith, such that heat from a first portion of the core transfers substantially to the base plate; and

a cover attachable to the base plate to form an enclosure at least partially enclosing the electromagnetic device, the cover including an extension extending therefrom and in thermal contact with the electromagnetic device when the cover is attached to the base plate, the thermal contact between the extension and the electromagnetic device being such that heat from a second portion of the core transfers substantially to the extension.

10. The electrical device of claim 9 , wherein the extension is placed in thermal contact with the electromagnetic device such that heat transferred from the second portion of the core to the extension inhibits a thermal gradient between the first and second portions of the core.

11. The electrical device of claim 9 , wherein the extension is placed in thermal contact with the electromagnetic device such that the extension is in thermal contact with at least one of the housing and the core without the housing being disposed therebetween.

12. The electrical device of claim 9 , further comprising a thermally conductive material disposed between the extension and the electromagnetic device.

13. An electromagnetic device arrangement, comprising:

an enclosure including a first portion and a second portion; and

an electromagnetic device including a core, a plurality of windings, and a housing disposed around at least a portion of the core and windings and defining a space therebetween, the electromagnetic device being mounted to and in thermal contact with the first portion of the enclosure, the second portion of the enclosure being configured to thermally contact the electromagnetic device when the first and second portions of the enclosure are attached to each other.

14. The electromagnetic device arrangement of claim 13 , wherein the second portion of the enclosure includes an extension projecting therefrom such that the extension thermally contacts the electromagnetic device when the first and second portions of the enclosure are attached to each other.

15. The electromagnetic device arrangement of claim 14 , wherein the extension is placed in thermal contact with the electromagnetic device such that a portion of the extension is in thermal contact with the housing and another portion of the extension is in thermal contact with the core without the housing being disposed therebetween.

16. The electromagnetic device arrangement of claim 14 , further comprising a thermally conductive material disposed between the extension and the electromagnetic device.

17. The electromagnetic device arrangement of claim 14 , wherein the first portion of the enclosure includes a base and the second portion of the enclosure includes a cover connected to the base to form the enclosure.

18. The electromagnetic device arrangement of claim 17 , wherein the extension is placed in thermal contact with the electromagnetic device on a side of the electromagnetic device opposite the base.

19. The electromagnetic device arrangement of claim 17 , wherein the core includes first and second portions connected to each other with an adhesive material, the electromagnetic device being disposed relative to the enclosure such that heat from the first portion of the core transfers substantially to the base, and heat from the second portion of the core transfers substantially to the extension.

20. The electromagnetic device arrangement of claim 13 , further comprising a thermally conductive material disposed between the second portion of the enclosure and the electromagnetic device.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Feb 5, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037702/0911 →
SECURITY INTEREST Recorded Mar 20, 2013
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 030076/0016 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2012
From: ANSARI, AJMAL; SHARAF, NADIR; PAVLOVIC, SLOBODAN
To: LEAR CORPORATION
Reel/Frame 027995/0540 →