Methods for improving thermal stability of silicon-bonded polycrystalline diamond
View Patent ↗Methods for preparing a silicon bonded PCD material involving a one step, double sweep process and drilling cutters made by such processes are disclosed. The PCD material includes thermally stable phases in the interstitial spaces between the sintered diamond grains. The method sweeps a diamond powder with a binder to form sintered PCD, reacts said molten binder with a temporary barrier separating said binder and said diamond from a silicon (Si) source, and sweeps said sintered PCD with said Si source to form SiC bonded PCD.
1. A method of preparing polycrystalline diamond with thermally stable phases in the interstitial spaces between the sintered diamond grains comprising:
sweeping a diamond powder with a binder to form sintered PCD;
reacting a temporary barrier with a molten phase of said binder, the temporary barrier separating said binder and said diamond from a silicon (Si) source; and
sweeping said sintered PCD with said Si source to form SiC bonded PCD.
2. The method of claim 1 , wherein the molten binder comprises a metal selected from the group consisting of Co, Ni, Fe, and combinations thereof.
3. The method of claim 2 , wherein the temporary barrier comprises a refractory metal selected from the group consisting of tantalum, molybdenum, niobium, titanium, zirconium, tungsten, vanadium, chromium, and combinations thereof.
4. The method of claim 3 , wherein the temporary barrier is a foil.
5. The method of claim 3 , wherein the silicon source is silicon or a silicon containing material.
6. The method of claim 5 , wherein the silicon containing material is selected from the group consisting of CrSi 2 , TiSi 2 , VSi 2 , and WSi 2 .
7. The method of claim 1 , wherein said temporary barrier is interposed between said Si source and said diamond powder.
8. The method of claim 1 , wherein said temporary barrier is interposed between said binder and said Si source.
9. The method of claim 1 , further comprising, prior to said sweeping said diamond powder,
loading a tantalum cup with
a first layer comprising said Si source,
a second layer comprising said temporary barrier,
a third layer comprising said diamond powder, and
a fourth layer comprising said binder; and
heating said tantalum cup under high pressure high temperature (HPHT) conditions.
10. The method of claim 9 , wherein said binder is
a powder of Fe, Co, Ni, or a combination thereof,
a disc of Fe, Co, Ni, or a combination thereof, or
a tungsten carbide disc impregnated with Fe, Co, Ni, or a combination thereof.
11. The method of claim 1 , further comprising, prior to said sweeping said diamond powder,
loading a tantalum cup with
a first layer comprising said diamond powder,
a second layer comprising said binder,
a third layer comprising said temporary barrier, and
a fourth layer comprising said Si source; and
heating said tantalum cup under HPHT conditions.
12. The method of claim 11 , wherein said binder is
a powder of Fe, Co, Ni, or a combination thereof,
a disc of Fe, Co, Ni, or a combination thereof, or
a tungsten carbide disc impregnated with Fe, Co, Ni, or a combination thereof.
13. A method of preparing polycrystalline diamond with thermally stable phases in the interstitial spaces between the diamond grains comprising:
sweeping a diamond powder with a binder to form sintered PCD;
reacting said binder with a temporary barrier separating said binder and said diamond from a silicon (Si) source; and
sweeping said sintered PCD with said Si source to form SiC bonded PCD.
14. The method of claim 13 wherein said binder comprises a solid disc.
15. The method of claim 13 , wherein said binder comprises a sintered tungsten carbide substrate.
16. The method of claim 13 , wherein said diamond powder is positioned adjacent to said binder.
17. The method of claim 13 , wherein said temporary barrier is positioned between said diamond powder and said silicon (Si) source.
18. The method of claim 13 , wherein said sweeping a diamond powder with a binder to form sintered PCD occurs in a first sweep direction and said sweeping said sintered PCD with said Si source to form SiC bonded PCD occurs in a second sweep direction, and wherein the first sweep direction is the same as the second sweep direction.
19. The method of claim 13 , wherein said sweeping a diamond powder with a binder to form sintered PCD occurs in a first sweep direction and said sweeping said sintered PCD with said Si source to form SiC bonded PCD occurs in a second sweep direction, and wherein the first sweep direction is opposite the second sweep direction.
20. The method of claim 13 , wherein said sweeping a diamond powder with a binder to form sintered PCD occurs in a first sweep direction and said sweeping said sintered PCD with said Si source to form SiC bonded PCD occurs in a second sweep direction, and wherein the first sweep direction is at an angle to the second sweep direction.
21. The method of claim 13 , wherein said binder sweeps and sinters a portion of said diamond powder before said sweep of said silicon (Si) source.
22. A method of preparing SiC bonded polycrystalline diamond, the method comprising:
sweeping a plurality of diamond particles with a binder phase including a molten solvent catalyst material to form a sintered diamond body, the sintered diamond body including bonded diamond, interstices between the diamond bonds and binder phase in the interstices;
contacting a barrier layer with the molten solvent catalyst material, the barrier layer separating the sintered diamond body from a silicon (Si) source;
reacting the barrier layer with the molten solvent catalyst material; and
after a delay period associated with the barrier layer reacting the molten solvent catalyst, sweeping the sintered diamond body with silicon from the silicon (Si) source,
wherein, during sweeping of the sintered diamond body with silicon from the silicon (Si) source, SiC is formed in the interstices, and
wherein the barrier layer includes a refractory metal foil.
23. The method of claim 22 , comprising bonding the sintered diamond body to a substrate during the step of sweeping with the binder phase.