IP Library Granted Patent US 8,389,998
Granted Patent B2
US 8,389,998 · App. 13/444,768 · Granted Mar 5, 2013

Thin film transistor array panel and method for manufacturing the same

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Quick Facts
Patent No.
US 8,389,998
App. No.
13/444,768
Granted
Mar 5, 2013
Kind
B2
Abstract

A thin film transistor substrate according to an embodiment of the present invention includes: an insulation substrate; a gate line formed on the insulation substrate; a first interlayer insulating layer formed on the gate line; a data line and a gate electrode formed on the first interlayer insulating layer; a gate insulating layer formed on the data line and gate electrode; a semiconductor formed on the gate insulating layer and overlapping the gate electrode; a second interlayer insulating layer formed on the semiconductor; a first connection formed on the second interlayer insulating layer and electrically connecting the gate line and the gate electrode to each other; a drain electrode connected to the semiconductor; a pixel electrode connected to the drain electrode; and a second connection connecting the data line and the semiconductor to each other.

Claims (17)

1. A thin film transistor substrate comprising:

an insulation substrate;

a gate line formed on the insulation substrate, wherein the gate line includes a copper layer;

a first interlayer insulating layer formed on the gate line;

a data line and a gate electrode formed on the first interlayer insulating layer;

a gate insulating layer formed on the data line and gate electrode;

a semiconductor formed on the gate insulating layer and overlapping the gate electrode, wherein the semiconductor is made of an oxide semiconductor;

a second interlayer insulating layer formed on the semiconductor;

a first connection formed on the second interlayer insulating layer and electrically connecting the gate line and the gate electrode to each other;

a drain electrode connected to the semiconductor;

a pixel electrode connected to the drain electrode;

a second connection connecting the data line and the semiconductor to each other; and

a storage electrode line formed on the insulation substrate and parallel to the gate line.

2. The thin film transistor substrate of claim 1 , wherein the storage electrode line includes a plurality of protrusions extending from the storage electrode line.

3. The thin film transistor substrate of claim 1 , further comprising a capacitive conductor formed on the first interlayer insulating layer and connected to the storage electrode line.

4. The thin film transistor substrate of claim 3 , further comprising a third connection formed on the second interlayer insulating layer and connecting the storage electrode line and the capacitive conductor to each other.

5. The thin film transistor substrate of claim 4 , wherein the third connection is made of a same material as the pixel electrode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028992/0078 →