Method for forming light-emitting device
View Patent ↗A method for forming a light-emitting device of the present application comprises providing a wafer; forming a first plurality of light-emitting elements on the wafer; providing a first connection structure to connect each of the first plurality of light-emitting elements; and applying a current flow to one of the first plurality of light-emitting elements for testing at least one electrical property of the light-emitting element while no current flow is applied to the remaining of the first plurality of light-emitting elements.
1. A method for forming a light-emitting device, comprising:
providing a wafer;
forming a first light-emitting element comprising a first electrode pattern for testing on the wafer;
forming a second light-emitting element comprising a second electrode pattern for testing on the wafer, wherein the first electrode pattern is different from the second electrode pattern;
forming a plurality of light-emitting elements for commercial use on the wafer, wherein one of the plurality of light-emitting elements comprises the first electrode pattern, another one of the plurality of light-emitting elements comprises the second electrode pattern;
providing a connection structure to permanently and simultaneously connect the plurality of light-emitting elements to each other; and
applying a current flow to the first light-emitting element for testing at least one optoelectrical property of the first light-emitting element or the second light-emitting element while no current flow is applied to the plurality of light-emitting elements.
2. The method according to claim 1 , further comprising forming a first pair of conductive pads electrically connected to the first light emitting element; and forming a second pair of conductive pads electrically connected to the second light emitting element.
3. The method according to claim 2 , wherein one of the first pair of conductive pads is formed outside the first light emitting element, the other one of the first pair of conductive pads is formed on the first light emitting element.
4. The method according to claim 1 , wherein the first light-emitting element comprises substantial the same structure as the one of the plurality of light-emitting elements.
5. The method according to claim 2 , wherein the second pair of conductive pads is formed outside the second light emitting element.
6. The method according to claim 1 , wherein the second light-emitting element comprises substantial the same structure as the another one of the plurality of light-emitting elements.
7. The method according to claim 2 , wherein the wafer comprises one test site where the first light-emitting element and the second light-emitting element are located and one device site where the plurality of light-emitting elements is located.
8. The method according to claim 7 , wherein the test site has an area equal to that of the device site.
9. The method according to claim 7 , wherein an area of the test site is multiple times of the area of the device site.
10. The method according to claim 7 , wherein the wafer further comprises a scribe area having a width separating the test site from the device site.
11. The method according to claim 10 , wherein one of the conductive pads has a width larger than the width of the scribe area.
12. The method according to claim 10 , wherein one of the conductive pads has a width smaller than the width of the scribe area.