Systems and methods for lead frame locking design features
View Patent ↗Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle.
1. A method comprising:
fabricating a lead frame for a chip package, the lead frame having a paddle that includes a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound;
fabricating the paddle to include at least a second segment of the edge with an extended-step-out bottom locking feature profile, wherein a step-out of the second segment has a greater width than a step-out of the first segment; and
alternating first and second segments along the edge of the paddle.
2. The method of claim 1 , further comprising:
securing at least one die to the paddle.
3. The method of claim 2 , further comprising:
encapsulating the paddle and the at least one die in a molding compound that secures the first segment and the second segment to the molding compound.
4. The method of claim 3 , further comprising:
fabricating one or more secondary elements of the paddle to have an overhanging-top locking feature profile, wherein the one or more secondary elements are secured to the molding compound by the overhanging-top locking feature profile.
5. The method of claim 1 , further comprising etching the lead frame to fabricate the step-out bottom locking feature for the first segment and the extended-step-out bottom locking feature profile for the second segment.
6. The method of claim 1 , further comprising stamping the lead frame to fabricate the step-out bottom locking feature for the first segment and the extended-step-out bottom locking feature profile for the second segment.
7. A method comprising:
fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound;
fabricating the paddle to have at least one second segment of the edge having a overhanging top locking feature profile; and
alternating first and second segments along the edge of the paddle.
8. The method of claim 7 , further comprising:
fabricating the paddle to provide a third segment between each first segment and second segment, the third segment providing a clearance gap.
9. The method of claim 7 , further comprising:
securing at least one die to the paddle.
10. The method of claim 9 , further comprising:
encapsulating the paddle and the at least one die in a molding compound that secures the first segment and the second segment to the molding compound.
11. The method of claim 10 , further comprising:
fabricating one or more secondary elements of the paddle to have an overhanging-top locking feature profile, wherein the one or more secondary elements are secured to the molding compound by the overhanging-top locking feature profile.
12. The method of claim 7 , further comprising etching the lead frame to fabricate the step-out bottom locking feature for the first segment and the extended-step-out bottom locking feature profile for the second segment.
13. The method of claim 7 , further comprising stamping the lead frame to fabricate the step-out bottom locking feature for the first segment and the extended-step-out bottom locking feature profile for the second segment.