IP Library Granted Patent US 8,879,247
Granted Patent B2
US 8,879,247 · App. 13/446,647 · Granted Nov 4, 2014

Computer chassis cooling sidecar

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Quick Facts
Patent No.
US 8,879,247
App. No.
13/446,647
Granted
Nov 4, 2014
Kind
B2
Abstract

A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Claims (28)

1. A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar comprising:

an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber;

wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

2. The computer chassis cooling sidecar of claim 1 wherein the directional vane is insulated and the computer chassis cooling sidecar includes an air outtake chamber thermally separated from the air intake chamber by the insulated directional vane and wherein a side of the directional vane exposed to the air outtake chamber is shaped to direct airflow from the air outtake chamber to a chimney.

3. The computer chassis cooling sidecar of claim 2 wherein the chimney is located at a top of the computer chassis cooling side car.

4. The computer chassis cooling sidecar of claim 1 wherein the chassis delivery chamber also has an opening at a bottom end for receiving air from beneath the data center in front or back of the computer chassis.

5. The computer chassis cooling sidecar of claim 1 wherein the air intake chamber and the chassis delivery chamber are connected to make an L-shaped chamber.

6. The computer chassis cooling sidecar of claim 1 wherein the computer chassis cooling sidecar is attached to the exterior of a computer chassis.

7. The computer chassis cooling sidecar of claim 1 wherein the computer chassis cooling sidecar is integrated within the interior of a computer chassis.

8. The computer chassis cooling sidecar of claim 1 wherein the chassis of computers further comprises a blade environment.

9. A system for cooling one or more computers in a chassis of computers in a data center, the system comprising:

a computer chassis cooling sidecar comprising an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening for receiving cooled air from source of cooled air,

the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; and wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis; and

a source of cooled air providing cooled air to the air intake chamber.

10. The system of claim 9 wherein the source of cooled air comprises an air conditioning unit below the floor of a data center.

11. The system of claim 9 wherein the directional vane is insulated and the computer chassis cooling sidecar includes an air outtake chamber thermally separated from the air intake chamber by the insulated directional vane and wherein a side of the directional vane exposed to the air outtake chamber is shaped to direct airflow from the air outtake chamber to a chimney.

12. The system of claim 11 wherein the chimney is located at a top of the computer chassis cooling side car.

13. The system of claim 9 wherein the chassis delivery chamber also has an opening at a bottom end for receiving air from beneath the data center in front or back of the computer chassis.

14. The system of claim 9 wherein the air intake chamber and the chassis delivery chamber are connected to make an L-shaped chamber.

15. The system of claim 9 wherein the computer chassis cooling sidecar is attached to the exterior of a computer chassis.

16. The system of claim 9 wherein the computer chassis cooling sidecar is integrated within the interior of a computer chassis.

17. The system of claim 9 wherein the chassis of computers further comprises a blade environment.

18. A method of cooling one or more computers in a chassis of computers in a data center, the method comprising:

receiving, by a sidecar positioned exterior to the computer chassis through perforated tiles in the floor of the data center located on the side of the computer chassis, cooled air; and

directing, by the sidecar, the cooled air from the side of the computer chassis to the front or back of the computer chassis.

19. The method of claim 18 further comprising:

directing air from the back of the computer chassis to the side of the computer chassis;

directing air from the side of the computer chassis above the computer chassis.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 050300/0570 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT DOCUMENT CONTAINING TYPO ERRORS PREVIOUSLY RECORDED AT REEL: 037101 FRAME: 0969. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 28, 2015
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037689/0190 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2015
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037101/0969 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 034194/0111 →