Jig for semiconductor production and method for producing same

1. A jig for semiconductor production which is used for a CVD device in a semiconductor production process and comprises a jig base and an SiC coating film formed on the jig base,

wherein the SiC coating film has a surface area ratio (surface area S 2 /surface area S 1 ) between an apparent surface area S 1 at the interface of the jig base and the SiC film as calculated on the assumption that the surface is flat and free from unevenness and an actual surface area S 2 , of from 1.4 to 3.2, and

wherein the SiC coating film is covered with pyramidal SiC crystallites on the surface thereof, and

the SiC crystallite has an average value of an aspect ratio (height H/minimum length L of the base) between a height H of the pyramid and the minimum length L of the base of the pyramid, of from 0.5 to 1.5.

2. The jig for semiconductor production according to claim 1 , wherein

the SiC coating film contains at least α-type crystal structure, and in the peak measured by X-ray diffraction,

a ratio))(I-65°/(I-60° between a peak intensity)(I-60° in a range of 2θ=59.5° to 60.5° and a peak intensity)(I-65° in a range of 2θ=65° to 66° is 0.1 or more,

and a ratio {(I-35°/[(I-41°+(I-65°]} between a peak intensity)(I-35° in a range of 2θ=35° to 36° and the sum of a peak intensity)(I-41°) in a range of 2θ-41° to 42° and the peak intensity)(I-65° of 2θ=65° to 66° is 50 or more.

3. The jig for semiconductor production according to claim 1 , wherein the SiC coating film has an average of the minimum length L of the base of the pyramidal SiC crystallite covering the surface of from 0.5 to 10.0 μm.

4. The jig for semiconductor production according to claim 1 , wherein the SiC coating film has a thickness of from 20 to 150 μm.

5. The jig for semiconductor production according to claim 1 , wherein the SiC coating film has an average surface roughness Ra of from 0.5 to 3.0 μm.

6. The jig for semiconductor production according to claim 1 , wherein the SiC coating film has a metal impurity concentration of from 0.005 to 0.5 ppm.

7. The jig for semiconductor production according to claim 1 , wherein the SiC coating film has the number of anomalous grains of less than 1/cm 2 .

8. The jig for semiconductor production according to claim 1 , wherein the jig base comprises Si-impregnated SiC.

9. A method for producing the jig for semiconductor production according to claim 1 , the method comprising introducing raw material compounds that is to form an SiC coating film, into a CVD device having a jig base stored therein, and forming an SiC coating film in a non-oxygen atmosphere having an oxygen gas concentration of 10,000 ppm or less under the conditions of from 1,100° C. to 1.350° C. and from 0.1 kPa to 2.6 kPa.