Through-hole-vias in multi-layer printed circuit boards

1. A method of use of a multi-layer printed circuit board (‘PCB’) comprising:

driving, from a first circuit on a first laminate layer of the PCB to a second circuit on a second laminate layer of the PCB through a via, an alternating current signal; and

receiving the signal in the second circuit, the signal characterized by an insertion loss in traversing the via,

the PCB comprising layers of laminate and the via, the via comprising a via hole traversing the layers of laminate, the via hole containing a via conductor comprising a used portion and an unused portion,

the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper, wherein both the used portion and the unused portion of the via conductor comprise copper and only the unused portion of the via conductor is coated with the metal having a conductivity lower than the conductivity of copper.

2. The method of claim 1 wherein the alternating current signal is characterized by a frequency high enough to demonstrate skin effect, moving the alternating current toward the surface of the via conductor.

3. The method of claim 1 wherein:

the unused portion of the via conductor has no connection to any further trace,

the unused portion of the via conductor implements a resonant stub effecting an insertion loss of the alternating current signal centered on a resonant frequency, and

the metal having the conductivity lower than the conductivity of copper increases resistive dampening of resonance and reduces the insertion loss.

4. The method of claim 1 wherein the metal having the conductivity lower than the conductivity of copper is iron or nickel.