Opto-coupler and method of manufacturing the same
View Patent ↗A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing opto-couplers are disclosed. Even more specifically, the opto-coupler includes a lens assembly to enhance light coupling efficiency between an optical transmitter and an optical receiver. An encapsulant material may also be utilized.
1. An optical isolation device, comprising:
a substrate;
an optical receiver arranged on the substrate and connected to a first set of electrical leads operating at a first voltage, wherein the optical receiver comprises an optical receiver die with a photodetector provided thereon;
a first dielectric layer arranged on the optical receiver;
a lens assembly arranged on the first dielectric layer;
a second dielectric layer arranged on the lens assembly; and
an optical transmitter arranged on the second dielectric layer and connected to a second set of electrical leads operating at a second voltage that is different from the first voltage, wherein the first dielectric layer and a first adhesive layer extend beyond an area of the photodetector thereby increasing a creepage distance between the first set of electrical leads and the second set of electrical leads.
2. The optical isolation device of claim 1 , wherein the lens assembly includes at least one of a glass material, an epoxy material, and a polymer material.
3. The optical isolation device of claim 2 , wherein the lens assembly comprises at least two lenses.
4. The optical isolation device of claim 1 , wherein the substrate comprises an integrated circuit and wherein the first voltage differs from the second voltage by at least 2.5 kV.
5. The optical isolation device of claim 1 , wherein the first dielectric layer comprises a thickness between 2 mil and 6 mil.
6. The optical isolation device of claim 1 , wherein the first dielectric layer and the second dielectric layer are both no thicker than 6 mil.
7. The optical isolation device of claim 1 , wherein the adhesive layer is arranged on at least one side of the first dielectric layer and second dielectric layer.
8. The optical isolation device of claim 1 , wherein the adhesive layer comprises a tape.
9. An opto-coupler, comprising:
a substrate;
an optical receiver arranged on the substrate;
a first adhesive material of substantially uniform thickness;
a first dielectric layer sandwiched between the optical receiver and the first adhesive,
a lens assembly arranged on the first adhesive material;
a second adhesive material of substantially uniform thickness;
an optical transmitter arranged on the second adhesive material, wherein the first adhesive material and the second adhesive material provide electrical isolation between the optical receiver and the optical transmitter, which are operating at a voltage difference of at least 2.5 kV; and
a second dielectric layer sandwiched between the optical transmitter and the second adhesive material.
10. The opto-coupler of claim 9 , wherein the first adhesive material comprises a transparent epoxy material.
11. The opto-coupler of claim 9 , wherein the first adhesive material comprises tape.
12. The opto-coupler of claim 9 , further comprising a lead frame having a first set of leads and a second set of leads, wherein the optical receiver is electrically connected to the first set of leads, wherein the optical transmitter is electrically connected to the second set of leads, and wherein the first and second adhesive materials provide electrical isolation between the first set of leads and the second set of leads.
13. The opto-coupler of claim 9 , wherein the optical receiver comprises at least one of a photo-diode and photo-transistor.
14. The opto-coupler of claim 9 , wherein the opto-coupler is a multi-channel opto-coupler.
15. A method of manufacturing an opto-isolator, comprising:
providing a substrate;
connecting an optical receiver to a first set of electrical leads operating at a first voltage;
disposing the optical receiver on the substrate;
providing a first adhesive material on the optical receiver;
providing a lens assembly on the first adhesive material;
providing a first dielectric layer between the lens assembly and the optical receiver;
providing a second adhesive material on the lens assembly;
disposing an optical transmitter on the second adhesive material;
providing a second dielectric layer between the lens assembly and the optical transmitter;
connecting the optical transmitter to a second set of electrical leads operating at a second voltage that is different from the first voltage by at least 2.5 kV;
using the first dielectric layer, the first adhesive material, the lens assembly, the second dielectric layer, and the second adhesive material to provide an electrical isolation between the first set of leads and the second set of leads; and
providing an encapsulant around the substrate, optical receiver, first adhesive material, lens assembly, second adhesive material, and optical transmitter.
16. The method of claim 15 , wherein the lens assembly comprises at least two lenses.
17. The method of claim 15 , wherein at least one of the first adhesive material and second adhesive material comprises tape.
18. The method of claim 15 , wherein the opto-coupler is a multi-channel opto-coupler.
19. The method of claim 15 , wherein the optical receiver comprises at least one of a photo-diode and photo-transistor.
20. The method of claim 15 , wherein the first adhesive material comprises a transparent epoxy material.