IP Library Granted Patent US 8,887,375
Granted Patent B2
US 8,887,375 · App. 13/451,781 · Granted Nov 18, 2014

Method for manufacturing earphone

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Quick Facts
Patent No.
US 8,887,375
App. No.
13/451,781
Granted
Nov 18, 2014
Kind
B2
Abstract

An earphone includes an earphone housing, a speaker positioned in the earphone, and an earphone cable connected to the speaker. The earphone housing has a first housing and a second housing. The first housing forms a first connecting surface, and the second housing forms a second connecting surface. The first connecting surface and the second connecting surface abut against each other and are ultrasonically fused together, in which excess plastic is formed and arranged along a fusing line. A method of manufacturing above-described earphone is also provided. The method also includes the forming of an excess plastic arranged along a fusing line formed between the first housing and the second housing made during ultrasonic fusion, the removing of excess plastic of the earphone phone by a cutter, and the grinding of the earphone housing by a grinding device.

Claims (15)

1. A method of manufacturing an earphone, comprising:

providing a first housing, a second housing, a soft plastic piece, a speaker, and an earphone cable, wherein the soft plastic piece is positioned on the second housing, the speaker is positioned in the second housing, and the earphone cable is connected to the speaker;

positioning the first housing on the second housing, and fusing the first housing and the second housing together to form an earphone housing by an ultrasonic fusion device, wherein the soft plastic piece is located between the first housing and the second housing;

removing an excess plastic of the earphone housing by a cutter; and

grinding the earphone housing by a grinding device.

2. The method of manufacturing the earphone of claim 1 , wherein in the step of positioning the first housing on the second housing, the ultrasonic fusion device comprises a positioning frame and a fusing head, the second housing is disposed in the positioning frame, and the fusing head presses the first housing to abut against the second housing.

3. The method of manufacturing the earphone of claim 2 , wherein after the first housing and the second housing are fused together, a fusing line is formed between the first housing and the second housing, and the excess plastic is formed and arranged along the fusing line.

4. The method of manufacturing the earphone of claim 3 , wherein the cutter comprises a profiling surface and a cutting edge formed at a side of the profiling surface, in the step of removing excess plastic of the earphone housing by the cutter, the cutting edge cuts the excess plastic along the fusing line.

5. The method of manufacturing the earphone of claim 4 , wherein in the step of grinding the earphone housing by the grinding device, the grinding device forms a grinding surface matching a side surface of the earphone housing along the fusing line.

6. The method of manufacturing the earphone of claim 5 , wherein the grinding device is a polishing wheel.

7. A method of manufacturing an earphone, comprising:

providing a first housing, a second housing, a speaker, an ultrasonic fusion device, and an earphone cable, wherein the speaker is positioned in the second housing, and the earphone cable is connected to the speaker, the ultrasonic fusion device comprises a positioning frame and a fusing head;

disposing the second housing in the positioning frame, and pressing the first housing to abut against the second housing with the fusing head, wherein the first housing and the second housing is fused together to form an earphone housing;

removing an excess plastic of the earphone housing by a cutter; and

grinding the earphone housing by a grinding device.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2018
From: FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
To: SHENZHENSHI YUZHAN PRECISION TECHNOLOGY CO., LTD.; CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.
Reel/Frame 045222/0101 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2012
From: XIONG, YI; LIN, ZHI-HUA; JIANG, HAI-BING
To: FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 028080/0890 →