Method for sealing wood subfloors

1. A method of applying a flooring system on a wood subfloor, comprising:

providing a sealer for direct application to the wood subfloor, wherein the sealer is a water-borne epoxy coating with viscosity no more than 11 cps, wherein the coating is obtained by mixing together water, resin and a hardener;

applying the sealer to the wood subfloor by at least one of spraying rolling, pouring and spreading;

allowing the sealer to air dry and cure, forming a sealed and stable wood subfloor; and

installing a gypsum based, pourable, self-leveling underlayment directly upon the sealed and stable wood subfloor by pouring the underlayment and allowing it to self-level, wherein the method is performed without a moisture vapor fabric.

2. The method of claim 1 wherein the wood subfloor is a wood plank board.

3. The method of claim 1 wherein the gypsum based underlayment is installed and configured to have a thickness between 0.64 cm and 1.9 cm thick.

4. The method of claim 1 wherein the sealer provided is SIKAFLOOR® Fast Track Primer sealer.

5. The method of claim 4 further comprising diluting the SIKAFLOOR® Fast Track Primer sealer with water to provide a diluted sealer mixture for direct application to the wood subfloor.

6. The method of claim 5 wherein the diluted sealer mixture is about 12.5% solids.

7. The method of claim 5 wherein the diluted sealer mixture is about 9% solids.

8. The method of claim 1 wherein the underlayment is one of LEVELROCK® 2500 and LEVELROCK® 3500 underlayment.