Tin and tin-zinc plated substrates including Cu
View Patent ↗An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 μIn maximizes formation of an intermetallic compound Cu 3 Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu 6 Sn 5 during baking to provide adequate corrosion resistance during battery operation.
1. A method to manufacture a zinc electrode substrate for a nickel zinc battery cell, the method comprising:
(a) providing a strip of substrate material, said substrate material comprising copper;
(b) electroplating metal onto the strip in an electroplating bath comprising a tin ion source; and
(c) baking the plated substrate by maintaining a higher than ambient temperature for a period of time to form a layer comprising copper-tin intermetallic compounds, such that said copper-tin intermetallic compounds comprise at least about 90% Cu 3 Sn and comprise Cu 6 Sn 5 in an amount of less than about 10% of the formed intermetallic compounds.
2. The method of claim 1 , further comprising electrolytically cleaning the strip prior to the electroplating.
3. The method of claim 1 , wherein 40-80 μIn of metal is electroplated in (b).
4. The method of claim 1 , further comprising pasting a layer of zinc oxide based electrochemically active material onto the substrate after the electroplating.
5. The method of claim 1 , wherein the metal deposited in (b) further comprises zinc from a zinc ion source in the electrolyte bath.
6. The method of claim 1 , wherein the metal deposited in (b) comprises about 75-100% weight tin and about 0-25% weight zinc.
7. The method of claim 1 , wherein the substrate material further comprises zinc, wherein the copper and zinc form a brass alloy.
8. The method of claim 2 , wherein the electrolytic cleaning is performed for a period of about 5-10 minutes in an alkaline soak solution.
9. The method of claim 8 , wherein the alkaline soak solution has a pH of about 10-13.
10. The method of claim 9 , wherein the alkaline soak solution comprises a component selected from the group consisting of an alkaline hydroxide, an alkaline carbonate, and an alkaline phosphate.
11. The method of claim 2 , further comprising activating the strip, after electrolytic cleaning and before electroplating, wherein the activation operation comprises immersing the strip in an activation solution comprising an acid.
12. The method of claim 11 , wherein the activation solution has a pH of about 0.2-3.
13. The method of claim 11 , wherein the activation solution comprises sulfuric acid at an acid concentration of 4-20%.
14. The method of claim 1 , wherein the electroplating operation occurs at a current density of about 40-80 A/m 2 for a period of about 4-6 minutes.
15. The method of claim 1 , wherein the electroplating bath comprises a current carrier source and no brightening agent.
16. The method of claim 1 , wherein the electroplating bath has a pH of about 0.1-3.
17. The method of claim 16 , wherein the electroplating bath further comprises an oxidation retardant and an anti-treeing agent.
18. The method of claim 1 , wherein the baking operation comprises maintaining the substrate at a temperature of about 200-350° C. for a period of about 30 minutes to 2 hours.
19. The method of claim 1 , wherein (b) comprises electroplating metal consisting essentially of
(i) tin or
(ii) tin and zinc.