IP Library Granted Patent US 8,724,327
Granted Patent B2
US 8,724,327 · App. 13/455,145 · Granted May 13, 2014

Heat sink assembly

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Quick Facts
Patent No.
US 8,724,327
App. No.
13/455,145
Granted
May 13, 2014
Kind
B2
Abstract

A heat sink assembly includes a heat sink, two first fixing structures, and two second fixing structures. The heat sink includes a base. The base includes two opposite sidewalls each forming a fixing portion. When the heat sink is mounted to a first motherboard, the first fixing structures are respectively and detachably connected to the fixing portions of the heat sink, and fix the heat sink to the first motherboard. When the heat sink is mounted to a second motherboard, the second fixing structures are detachably connected to fixing portions of the heat sink, and fix the heat sink to the second motherboard.

Claims (12)

1. A heat sink assembly, comprising:

a heat sink comprising a base, the base comprising two opposite sidewalls each forming a fixing portion;

two first fixing structures, wherein when the heat sink is mounted to a first motherboard, the two first fixing structures are respectively and detachably connected to the fixing portions of the heat sink, and fix the heat sink to the first motherboard; and

two second substantially different fixing structures, wherein when the heat sink is mounted to a second motherboard, the two second fixing structures are respectively and detachably connected to the fixing portions of the heat sink, and fix the heat sink to the second motherboard.

2. The heat sink assembly of claim 1 , wherein the fixing portions are threaded holes, each of the first and second fixing structures comprises a threaded shaft, to engage in a corresponding one of the threaded holes.

3. The heat sink assembly of claim 2 , wherein each of the first fixing structures further comprises a first block connected to the corresponding threaded shaft, a through hole defined in the first block, and a fastener extended through the through hole for engaging with the first motherboard.

4. The heat sink assembly of claim 3 , wherein each fastener comprises a head, a pole extending down from a middle of a bottom of the head, and a resilient hook protruding from a bottom of the pole, the hook extends through the through hole of the corresponding first block, for extending through the first motherboard and engaging with a bottom of the first motherboard.

5. The heat sink assembly of claim 4 , wherein a spring is placed around each pole and sandwiched between the corresponding head and the first block.

6. The heat sink assembly of claim 3 , wherein each fastener comprises a head, a pole extending down from a middle of a bottom of the head, and a threaded portion formed on a bottom of the pole, the threaded portion extends through the through hole of the corresponding first block and the first motherboard to engage with a nut.

7. The heat sink assembly of claim 6 , wherein a spring is placed around each pole and sandwiched between the corresponding head and the first block.

8. The heat sink assembly of claim 3 , wherein each of the second fixing structures further comprises a second block connected to the corresponding threaded shaft, and a latch connected to the second block for engage with the second motherboard.

9. The heat sink assembly of claim 8 , wherein the latch is bent by a metal rod, and comprises a substantially U-shaped bent portion connected to the second block, and a substantially U-shaped top opened latching portion extending down from a distal end of the bent portion.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2018
From: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
To: HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO.,LTD.
Reel/Frame 045501/0324 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2012
From: MA, XIAO-FENG; LIU, LEI
To: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 028100/0971 →