Methods and systems for measuring crimp quality
View Patent ↗A method is provided for evaluating a crimp procedure in a manufacturing process. In one embodiment, the method includes, but is not limited to, completing a crimp procedure on a single wire. The method further includes, but is not limited to, evaluating a quality of the crimp procedure based on time-domain reflectometry. The method still further includes, but is not limited to, generating reporting data based on the evaluating.
1. A method of evaluating a crimp procedure in a manufacturing process, the method comprising:
completing a crimp procedure on a single wire;
evaluating a quality of the crimp procedure based on time-domain reflectometry; and
generating reporting data based on the evaluating, wherein the evaluating comprises
generating test pulses;
receiving reflected test pulses through a connector connected to a wire tray that holds the single wire; and
evaluating the reflected pulses.
2. The method of claim 1 , wherein the evaluating the quality of the crimp procedure comprises comparing an actual impedance of the wire with an expected impedance of the wire.
3. The method of claim 2 , wherein the expected impedance is predetermined data that is retrieved from a datastore.
4. The method of claim 1 , wherein the generating reporting data comprises generating graphical data that indicates a status of the evaluating.
5. The method of claim 1 , wherein the generating reporting data comprises generating textual data that indicates a status of the evaluating.
6. The method of claim 1 , further comprising determining a distance to a fault of the single wire based on the reflected pulses.
7. The method of claim 6 , wherein the generating the reporting data comprises generating reporting data that graphically represents the distance with respect to the single wire.
8. The method of claim 6 , wherein the generating the reporting data comprises generating reporting data that textually represents the distance with respect to the single wire.
9. A system for evaluating a crimp procedure of a wire in a manufacturing process, the system comprising:
a crimp apparatus that includes a wire tray that holds the wire; and
a crimp quality measurement module that couples to the wire tray and that evaluates a quality of a crimp procedure performed on a single wire by the crimp apparatus, and that generates reporting data based on the evaluation, wherein the evaluation is based on time-domain reflectomertry.
10. The system of claim 9 , wherein the crimp quality measurement module evaluates the quality of the crimp procedure by generating test pulses, receiving reflected pulses based on the test pulses, and evaluating the reflected pulses.
11. The system of claim 9 , wherein the crimp quality measurement module evaluates the quality of the crimp procedure by comparing an actual impedance of the wire with an expected impedance of the wire.
12. The system of claim 9 , wherein the expected impedance is predetermined data that is retrieved from a datastore.
13. The system of claim 9 , wherein the reporting data includes at least one of graphical data and textual data that indicates a status of the evaluation.
14. The system of claim 9 , wherein the crimp quality measurement module determines a distance to a fault of the single wire based on the reflected pulses.
15. The system of claim 14 , wherein the reporting data includes textual data that represents the distance with respect to the single wire.
16. The system of claim 14 , wherein the reporting data includes graphical data that represents the distance with respect to the single wire.