Electron emitter and method of making same

1. A method of forming an electron emitter, comprising:

winding a conductive member around a first mandrel having a substantially planar side;

forming a plurality of filament segments from the conductive member, each filament segment including an intermediate portion configured to emit electrons, the intermediate portions lying on the substantially planar side of the first mandrel;

stress relieving and setting the profile of the electron emitter to substantially match the profile of the first mandrel; and

forming a substantially planar electron emission surface on each intermediate portion.

2. The method of claim 1 , wherein forming a substantially planar electron emission surface on each intermediate portion comprises winding a conductive member comprising ribbon wire or a wire having a square, rectangular, oval or elliptical cross-section around the first mandrel.

3. The method of claim 1 , wherein forming a substantially planar electron emission surface on each intermediate portion includes one or more of: electrical discharge machining, etching, or grinding of the intermediate portions.

4. The method of claim 1 , further comprising, selectively carburizing the conductive member at the substantially planar electron emission surfaces.

5. The method of claim 4 , wherein selectively carburizing the conductive member at the substantially planar electron emission surfaces includes:

coating the conductive member with an insulating material;

removing the insulating material from the substantially planar electron emission surfaces;

subjecting the conductive member to a carburizing treatment, the remaining insulating material substantially preventing carburization of the conductive member except at the substantially planar electron emission surfaces; and

removing the remaining insulating material.

6. The method of claim 4 , wherein selectively carburizing the conductive member at the substantially planar electron emission surfaces includes:

heating the conductive member in an oven; and

bringing the substantially planar electron emission surfaces into contact with one or more substantially planar carbon sources.

7. The method of claim 1 , further comprising heating the electron emitter to electron emission temperature.

8. The method of claim 7 , wherein heating the electron emitter to electron emission temperature includes:

applying an electric current to the conductive member;

applying an electric current to the first mandrel about which the conductive member is wound; or applying an electric current to a second mandrel disposed within a space defined by the electron emitter, the space formed by winding the conductive member around the first mandrel and removing the first mandrel, the second mandrel being smaller than the first mandrel.

9. The method of claim 1 , wherein the profile of the electron emitter is stress relieved and set by recrystallizing the conductive member.

10. A method of forming an electron emitter, comprising:

forming a conductive member about a mandrel having at least one substantially planar side;

forming a plurality of filament segments from the conductive member, at least some of the filaments segments including an intermediate portion configured to emit electrons; and

positioning each of the intermediate portions on the substantially planar side of the mandrel so that each of the intermediate portions are substantially coplanar with respect to each other.

11. The method of claim 10 , wherein the conductive member comprises ribbon wire or a wire having a square, rectangular, oval or elliptical cross-section.

12. The method of claim 10 , further comprising stress relieving and setting the profile of the electron emitter to substantially match the profile of the mandrel.

13. The method of claim 10 , further comprising forming a substantially planar electron emission surface on each intermediate portion.

14. The method of claim 13 , wherein forming a substantially planar electron emission surface on each intermediate portion includes one or more of: electrical discharge machining, etching, or grinding of the intermediate portions.

15. The method of claim 13 , further comprising, selectively carburizing the conductive member at the substantially planar electron emission surfaces.

16. The method of claim 15 , wherein selectively carburizing the conductive member at the substantially planar electron emission surfaces includes:

coating the conductive member with an insulating material;

removing the insulating material from the substantially planar electron emission surfaces;

subjecting the conductive member to a carburizing treatment, the remaining insulating material substantially preventing carburization of the conductive member except at the substantially planar electron emission surfaces; and

removing the remaining insulating material.

17. The method of claim 15 , wherein selectively carburizing the conductive member at the substantially planar electron emission surfaces includes:

heating the conductive member in an oven; and

bringing the substantially planar electron emission surfaces into contact with one or more substantially planar carbon sources.

18. The method of claim 10 , further comprising heating the electron emitter to electron emission temperature.

19. The method of claim 18 , wherein heating the electron emitter to electron emission temperature includes:

applying an electric current to the conductive member;

applying an electric current to the mandrel about which the conductive member is formed; or

applying an electric current to a second mandrel disposed within a space defined by the electron emitter, the space formed by forming the conductive member around the mandrel and removing the mandrel, the second mandrel being smaller than the mandrel to which the conductive member was formed.

20. The method of claim 12 , wherein the profile of the electron emitter is stress relieved and set by recrystallizing the conductive member.