IP Library Granted Patent US 8,839,638
Granted Patent B2
US 8,839,638 · App. 13/466,468 · Granted Sep 23, 2014

Cooling system for electronic equipment

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Quick Facts
Patent No.
US 8,839,638
App. No.
13/466,468
Granted
Sep 23, 2014
Kind
B2
Abstract

In a cooling system for an electronic device of the present invention, server rooms in which a plurality of servers are placed, an evaporator which is provided close to each of the servers, and cools exhaust air from the server by vaporizing a refrigerant with heat generating from the server, a cooling tower which is provided at a place higher than the evaporator, cools the refrigerant by outside air and water sprinkling, and condenses the vaporized refrigerant, and a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower. According to the cooling system, an electronic device which is required to perform a precise operation with a heat generation amount from itself being large, such as a computer and a server, can be efficiently cooled at low running cost.

Claims (9)

1. A cooling system for an electronic device, comprising:

an evaporator that cools exhaust air from the electronic device by vaporizing a refrigerant with heat generated from the electronic device;

a cooling tower which is provided at a place higher than the evaporator, cools the refrigerant and condenses the vaporized refrigerant;

a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower;

a heat exchanger which condenses the vaporized refrigerant to liquid refrigerant, wherein the refrigerant flows in a first piping of the heat exchanger and the water flows in a second piping of the heat exchanger, wherein the water flowing in the second piping cools and condenses the refrigerant in the first piping;

a parallel line connected to the circulation line, the parallel line being a flow path for the refrigerant and producing a parallel relationship between the heat exchanger and the cooling tower, wherein the vaporized refrigerant in the parallel line flows into the first piping where the refrigerant is condensed, and the condensed refrigerant flows into the parallel line and then into the circulation line;

a temperature sensor which is provided at an outlet of the first piping of the heat exchanger;

a valve which is provided in the second piping; and

a control device which controls the valve of the second piping based on a temperature measured by the temperature sensor.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE THAT THE ASSIGNEE NAME SHOULD READ HITACHI, LTD. PREVIOUSLY RECORDED ON REEL 031946 FRAME 0793. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE NAME SHOULD READ HITACHI, LTD. Recorded Feb 20, 2014
From: HITACHI PLANT TECHNOLOGIES, LTD.
To: HITACHI, LTD.
Reel/Frame 032287/0301 →
MERGER Recorded Jan 13, 2014
From: HITACHI PLANT TECHNOLOGIES, LTD.
To: HITACHI LTD.
Reel/Frame 031946/0793 →