Flexible circuit electrode array for improved layer adhesion
The present invention is a flexible circuit electrode array for improved layer adhesions where the metal conductors overlap the polymer insulator. The steps to build the flexible circuit are as follows. Deposit a base polymer layer. Deposit a conductive trace over the base polymer layer. Deposit a top polymer layer over the trace and prepare a void in the top polymer layer smaller than the surface of the trace. Deposit an electrode on the trace through the void with a periphery larger than, and overlapping the void.
1. A flexible circuit electrode array comprising:
a base polymer layer;
a conductive trace deposited on the base polymer layer;
a top polymer layer deposited on the base polymer layer and the trace, and defining a void, wherein at least a portion of the top polymer layer directly contacts the base polymer layer;
the trace forming an annular-shaped electrode base extending peripherally, between the base polymer layer and the top polymer layer, around and beyond the void; and
an electrode connected to the electrode base through the void and extending peripherally in an annular-shaped portion beyond the void.
2. The flexible circuit electrode array of claim 1 wherein base polymer layer and top polymer layers contain polyfluorocarbons, polyethylene, polypropylene, silicone, polyamide, polyimide, liquid crystal polymer, poly-paraxylylene, polyaryletherketone and/or derivatives and/or mixtures thereof.
3. The flexible circuit electrode array of claim 1 , wherein the conductive trace contains a base conducting layer, an intermediate conducting layer and a top conducting layer.
4. The flexible circuit electrode array of claim 3 , wherein the intermediate conducting layer contains platinum, tantalum, iridium, palladium, rhodium, rhenium, gold, chrome, molybdenum, or carbon, or an alloy thereof or a combination of two or more alloys or metal layers thereof.
5. The flexible circuit electrode array of claim 3 ,wherein the base conducting layer and the top conducting layers contain titanium, and the intermediate conducting layer contains whereby the trace forms a titanium/platinum/titanium film stack.
6. The electrode array of claim 1 wherein the electrode comprises a surface coating, the surface coating having at least 5 times the surface area of that for the corresponding surface area resulting from the basic geometric shape of the electrode.
7. The flexible circuit electrode array of claim 1 wherein the electrode comprises a surface coating, the surface coating being biocompatible.
8. The flexible circuit electrode array of claim 1 wherein the electrode comprises a surface coating, the surface coating having a surface area of less than 500 times the corresponding surface area resulting from the basic geometric shape.
9. The flexible circuit electrode array of claim 1 wherein the electrode comprises a surface coating, the surface coating comprising platinum having a fractal configuration, titanium nitride, iridium oxide, or mixtures thereof.
10. The flexible circuit electrode array of claim 1 , wherein the top polymer layer and the base polymer layer are made of different polymers.
11. The flexible circuit electrode array of claim 10 , wherein the top polymer layer is made of a polymer softer than the polymer of the base polymer layer.
12. The flexible circuit electrode array of claim 11 , wherein the base polymer layer is made of polyimide and the top polymer layer is made of silicone.
13. The flexible circuit electrode array of claim 1 , wherein the conductive trace separates the electrode from the base polymer layer.
14. The flexible circuit electrode array of claim 1 , wherein the electrode protrudes from the top polymer layer.
15. The flexible circuit electrode array according to claim 1 , wherein the electrode is thicker than the trace.
16. The flexible circuit electrode array according to claim 1 , wherein the trace is wider at the electrode than it is along the rest of its length.