Electrostatic chuck, thin film deposition apparatus including the electrostatic chuck, and method of manufacturing organic light emitting display apparatus by using the thin film deposition apparatus
View Patent ↗An electrostatic chuck, a thin film deposition apparatus including the electrostatic chuck, and a method of manufacturing an organic light emitting display apparatus using the thin film deposition apparatus. The electrostatic chuck includes: a first plate; a first common wire disposed on the first plate and electrically connected to a plus terminal of an electric power source; first electrode patterns electrically connected to the first common wire, separated by a distance from each other, and extending from the first common wire; a second common wire disposed on the first plate and electrically connected to a minus terminal of the electric power source; second electrode patterns electrically connected to the second common wire, separated by a distance from each other, and extending from the second common wire; a first additional wire electrically connected to the first common wire; and a second additional wire electrically connected to the second common wire.
1. A method of manufacturing an organic light emitting display apparatus, the method comprising:
disposing a substrate on an electrostatic chuck which comprises: a first plate; a first common wire disposed on the first plate and electrically connected to a plus (+) terminal of an electric power source; a plurality of first electrode patterns electrically connected to the first common wire between a first end and a second end of the first common wire, separated by a distance from each other, and extending from the first common wire; a second common wire disposed on the first plate and electrically connected to a minus (−) terminal of the electric power source; a plurality of second electrode patterns electrically connected to the second common wire, separated by a distance from each other, and extending from the second common wire; a first additional wire electrically connected to the first common wire at the first end and at the second end; and a second additional wire electrically connected to the second common wire;
conveying the electrostatic chuck on which the substrate is disposed to pass through a plurality of chambers that are maintained in a vacuum state; and
forming an organic layer on the substrate by using a thin film deposition assembly disposed in at least one of the chambers, by a movement of the electrostatic chuck or the thin film deposition assembly with respect to the other,
wherein the thin film deposition assembly comprises a pattering slit sheet smaller than the substrate in a direction parallel to a side of the substrate on which the organic layer is formed.
2. The method of claim 1 , wherein two end portions of the first additional wire are respectively connected to two edges of the first common wire.
3. The method of claim 1 , wherein two end portions of the second additional wire are respectively connected to two edges of the second common wire.
4. The method of claim 1 , wherein the plurality of first electrode patterns and the plurality of second electrode patterns are disposed alternately in parallel with each other.
5. The method of claim 1 , wherein the first electrode patterns are perpendicular to the first common wire.
6. The method of claim 1 , wherein the electrostatic chuck further comprises:
a second plate on which a plurality of the first plates are disposed;
a first connection wire disposed on the second plate to electrically connect the first common wires to each other; and
a second connection wire disposed on the second plate to electrically connect the second common wires to each other.