Hot melt moisture cure adhesive composition

1. An adhesive composition derived from:

(a) one or more polyester polyether copolymers of formula I:

wherein Nu is a predominately cyclic nucleus and R 1 is randomly selected from either a C 2-6 alkylene or an amorphous, long-chain polyether subunit comprising a polyoxyalkylene group;

(b) one or more polyisocyanate prepolymers comprising the reaction product of:

one or more polyols; and

a polyfunctional isocyanate having a functionality of about 2 or more;

(c) polymeric MDI; and

(d) a first aromatic or aromatic-aliphatic tackifying resin having a softening point greater than or equal to about 100° C.

2. The adhesive composition of claim 1 , wherein the composition addditionally comprises one or more vinyl polymers.

3. The adhesive composition of claim 1 , wherein the polymeric MDI is present at about 15 to about 30 weight percent with respect to the total adhesive composition.

4. The adhesive composition of claim 1 , wherein the polymeric MDI has a functionality of at least about 2.3.

5. The adhesive composition of claim 1 , wherein the composition further comprises a second tackifying resin.

6. The adhesive composition of claim 5 , wherein the first aromatic or aromatic aliphatic tackifying resin and the second tackifying resin are independently derived from monomers selected from the group consisting of C 4-6 diene monomers, styrenic monomers, indene monomers, dicyclopentadiene monomers, and mixtures thereof.

7. The adhesive composition of claim 5 , wherein the first aromatic or aromatic-aliphatic tackifying resin and the second tackifying resin are independently derived from styrene monomers, alpha-methylstyrene monomers, vinyl toluene monomers, methoxystyrene monomers, tertiary butyl styrene monomers, and combinations thereof.

8. The adhesive composition of claim 5 , wherein the first aromatic or aromatic-aliphatic tackifying resin has a softening point greater than or equal to about 130° C. and the second tackifying resin has a softening point that is from about 85° C. to about 120° C.

9. The adhesive composition of claim 5 , wherein the first aromatic or aromatic-aliphatic tackifying resin has a softening point greater than or equal to about 140° C. and the second tackifying resin has a softening point from about 100° to about 110° C.

10. The adhesive composition of claim 5 , wherein the ratio of the second tackifying resin to the first aromatic or aromatic-aliphatic tackifying resin can range from about 1:1 to about 3:1.

11. The adhesive composition of claim 1 wherein the polyester polyether copolymer has an Mw greater than or equal to about 100,000.

12. An article formed by laminating two substrates with the adhesive of claim 1 .

13. The article according to claim 12 , wherein at least one of the substrates comprises high pressure laminate (HPL), medium density fiberboard (MDF), or a high density mineral composite material.

14. The article according to claim 12 , wherein the article is a door.

15. The article according to claim 14 , wherein the article is a fire resistant door that passes UL 10C.

16. A method of forming an adhesive composition comprising the steps of:

(a) providing a first composition, the first composition comprising:

i. a first aromatic or aromatic-aliphatic tackifying resin having a softening point of equal to or greater than about 100° C.; and

ii. one or more polyester polyether copolymers of formula I:

wherein Nu is a predominately cyclic nucleus and R 1 is randomly selected from either a C 2-6 alkylene or an amorphous, long-chain polyether subunit comprising a polyoxyalkylene group; and

(b) combining the first composition with

i. one or more polyisocyanate prepolymers comprising the reaction product of:

one or more polyols; and

a polyfunctional isocyanate having a functionality of about 2 or more; and

ii. polymeric MDI.

17. A method of joining at least two substrates, the method comprising:

(a) applying an adhesive composition onto a surface of at least a first substrate, the adhesive composition comprising:

i. one or more polyester polyether copolymers of formula I:

wherein Nu is a predominately cyclic nucleus and R 1 is randomly selected from either a C 2-6 alkylene or an amorphous, long-chain polyether subunit comprising a polyoxyalkylene group;

ii. one or more polyisocyanate prepolymers comprising the reaction product of:

one or more polyols; and

a polyfunctional isocyanate having a functionality of about 2 or more;

iii. polymeric MDI; and

iv. a first aromatic or aromatic-aliphatic tackifying resin having a softening point greater than or equal to about 120° C.; and

(b) contacting the applied adhesive composition with a second substrate.

18. The method of claim 17 wherein the adhesive composition additionally comprises one or more vinyl polymers.

19. The method of claim 17 , wherein the polymeric MDI is present at about 10 to about 35 weight percent with respect to the total adhesive composition.

20. The method of claim 17 , wherein the adhesive composition further comprises a second tackifying resin having a softening point of less than 120° C.