Lightweight air-cooled transmit/receive unit and active phased array including same

1. A light-weight, air-cooled transmit/receive unit comprising:

a first external cover member;

an opposed second external cover member;

a central housing unit, including thermal management means, interposed between said first and second external cover members;

a transmit/receive circuit board, including components and an integrated and common radiating element for at least one channel, interposed between a first surface of said central housing unit and said first external cover member; and

a controller circuit board and a power converter circuit board interposed between an opposed second surface of said central housing unit and said second external cover member, wherein said central housing unit comprises a first plate, made of a light-weight, thermally and electrically conductive material, defining said first surface of said central housing unit and haying an opposed inner surface, and a second plate, made of a light-weight, thermally and electrically conductive material, defining said second surface of said central housing unit and having an opposed inner surface.

2. The light-weight, air-cooled transmit/receive unit according to claim 1 , wherein said thermal management means comprises at least one interconnected extended surface interposed between said respective inner surfaces of said first plate and said second plate.

3. The light-weight, air-cooled transmit/receive unit according to claim 1 , wherein said light-weight, thermally conductive material of said first and second plates comprises at least one material selected from the group consisting of aluminum, magnesium, titanium, metal-ceramic composites, thermally and electrically conductive plastics, and thermally and electrically conductive composite matrix having thermal enhancing materials embedded therein.

4. The light-weight, air-cooled transmit/receive unit according to claim 2 , wherein the thermal management means comprises at least one air passing heat exchanging unit.

5. The light-weight, air-cooled transmit/receive unit according to claim 1 , wherein said T/R components are electrically shielded from circuitry of the power converter circuit board and circuitry of the controller circuit board.

6. The light-weight, air-cooled transmit/receive unit according to claim 4 , wherein short, intimate interconnects provide for high fidelity power and signal transfer.

7. The light-weight, air-cooled transmit/receive unit according to claim 5 , wherein said T/R circuit board provides a low-loss, connector free RF signal path.

8. A phased active array comprising:

at least one array structure having a plurality of beamformer, power and communications harness raceways extending along one of a longitudinal direction and a lateral direction thereof and protruding from a first surface of said array structure;

at least one air supply manifold, located proximate an opposed second surface of said array structure, including an air supply distributor feeding a plurality of air coolant supply ducts extending along the longitudinal direction of said array structure and in fluid communication with said array structure via a plurality of openings passing from said first to said second surface of said array structure;

a plurality of light-weight, air-cooled transmit receive units positioned on said array structure in between said harness raceways and aligned with said air coolant supply openings, each said light-weight, air-cooled transmit receive unit comprising

a first external cover member;

an opposed second external cover member;

a central housing unit, including thermal management means, interposed between said first and second external cover members;

a transmit/receive circuit board, including components and a common and integrated radiating element for at least one channel, interposed between a first surface of said central housing unit and said first external cover member; and

a controller circuit board and a power converter circuit board, or a combined unit including both, interposed between an opposed second surface of said central housing unit and said second external cover member;

an array ground plane positioned above said plurality of light-weight, air-cooled transmit receive units and arranged so that said radiating members extend upwardly through corresponding opening is said ground plane; and

at least one removable radome panel covering said array, including said radiating elements and said array ground plane, and extending along one of the longitudinal length and the lateral length of said array structure.

9. The phased active array according to claim 8 , wherein said central housing unit of said light-weight, air-cooled transmit/receive unit comprises a first plate, made of a light-weight, thermally conductive material, defining said first surface of said central housing unit and having an opposed inner surface, and a second plate, made of a light-weight, thermally conductive material, defining said second surface of said central housing unit and having an opposed inner surface.

10. The phased active array according to claim 9 , wherein said thermal management means of said central housing unit of said light-weight, air-cooled transmit/receive unit comprises at least one interconnected extended surface interposed between said respective inner surfaces of said first plate and said second plate.

11. The phased active array according to claim 10 , wherein the thermal management means comprises at least one fin stock unit.

12. The phased active array according to claim 10 , wherein the air coolant exits said transmit/receive units and impinges upon the inner surface of the array radome.

13. The light-weight, air-cooled transmit/receive unit according to claim 1 , wherein said first and second external cover members comprises at least one material selected from the group consisting of metallics, metal-ceramic composites, electrically conductive plastics, or other electrically conductive materials.

14. The light-weight, air-cooled transmit/receive unit according to claim 1 , further comprising positioning pins and retention features for aligning with said array structure.