IP Library Granted Patent US 8,409,692
Granted Patent B2
US 8,409,692 · App. 13/470,562 · Granted Apr 2, 2013

Insulation structure for resistor grids

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Quick Facts
Patent No.
US 8,409,692
App. No.
13/470,562
Granted
Apr 2, 2013
Kind
B2
Abstract

An insulation board for a resistor grid and methods for manufacturing the same are disclosed. The insulation board consists of a plurality of longitudinal voids. One or more longitudinal structural members are disposed in the longitudinal voids. The longitudinal structural members may be shaped to conform to the shape of the longitudinal voids. The method of constructing the insulation board includes providing a profiled block and inserting one or more longitudinal structural members in the longitudinal voids. Alternatively, the insulation board may be constructed by providing one or more longitudinal structural members and molding a profiled block over the longitudinal structural members. One or more rows of transverse pin holes may be provided along the length of the insulation board for engaging pins of resistive elements of the resistor grid.

Claims (49)

1. An apparatus comprising:

a substantially planar element having an elongate shape and one or more longitudinal voids extending at least partially therethrough, wherein the substantially planar element is made of an electrically insulating material;

longitudinal structural members disposable within at least one of the one or more longitudinal voids, wherein the cross section of the longitudinal structural members conforms with the profile of the one or more longitudinal voids, wherein the longitudinal structural members are made of a metal; and

one or more rows of transverse pin holes, configured to engage pins of one or more resistive elements of a resistor grid, disposed along the length of the substantially planar element.

2. The apparatus of claim 1 , wherein the transverse pin holes conform with the profile of the corresponding pins engaged therewith.

3. The apparatus of claim 1 , wherein extending at least partially therethrough is nearly the entire length.

4. The apparatus of claim 1 , wherein at least one of the longitudinal structural members is rod-shaped and angled.

5. The apparatus of claim 1 , wherein at least one of the longitudinal structural members is a beam.

6. The apparatus of claim 1 , wherein at least one of the longitudinal structural members is a tube.

7. The apparatus of claim 1 , wherein the planar element is molded over the at least one of the longitudinal structural members.

8. The apparatus of claim 1 , wherein the longitudinal void of the planar element is configured to receive one of the longitudinal structural members that is insertable thereinto.

9. The apparatus of claim 8 , wherein the longitudinal structural members inserted in the longitudinal void reduce or prevent the warping or buckling of the planar element due to mechanical load.

10. The apparatus of claim 1 , wherein the planar element comprises one or more of fiber glass, glass, or ceramic.

11. The apparatus of claim 10 , wherein the planar element is a glass filled thermoplastic polymer.

12. The apparatus of claim 1 , wherein the planar element comprises a thermoset polymer.

13. The apparatus of claim 12 , wherein the planar element comprises a silicone.

14. The apparatus of claim 12 , wherein the planar element comprises a vinyl ester.

15. The apparatus of claim 1 , wherein the planar element is an insulation board that comprises vinyl ester, at least one longitudinal void does not run an entire length of the insulation board, and at least one of the longitudinal structural members is about rod-shaped and inserted in at least one longitudinal void and thereby to reduce or prevent the warping or buckling of the planar element due to mechanical load.

16. A resistor grid, comprising:

the apparatus of claim 1 ; and

a plurality of resistive elements having pins, wherein the pins are engaged in the pin holes.

17. An apparatus, comprising:

an insulation board having a top surface, wherein the insulation board defines one or more voids extending at least partially through an interior of the insulation board, and wherein the insulation board is made of an electrically insulating material, wherein the insulation board comprises one or more of a vinyl ester thermoset polymer or silicone; and

one or more structural members disposed within at least one of the one or more voids for supporting the insulation board, wherein the structural members are made of a material that is different from the electrically insulating material, and

the insulation board further defines plural pin holes, which are configured to engage pins of one or more resistive elements of a resistor grid, disposed along a length of the top surface of the insulation board and extending into the insulation board.

18. A resistor grid comprising:

the apparatus of claim 17 ; and

a plurality of resistive elements having pins, wherein the pins are engaged in the pin holes of the insulation board.

19. A method of constructing an insulation board for a resistor grid, the method comprising:

providing a profiled block of a high temperature electrical insulator, wherein the profiled block comprises one or more longitudinal voids;

inserting one or more longitudinal structural members in at least one of the one or more longitudinal voids, wherein the cross section of the longitudinal structural members conforms with the profile of the one or more longitudinal voids, wherein at least one of the one or more longitudinal structural members is metal; and

providing one or more rows of transverse pin holes along the length of the profiled block, for engaging pins of one or more resistive elements of the resistor grid.

20. The method of claim 19 , further comprising selecting the one or more longitudinal structural members to have substantially higher stiffness than the insulation board material.

21. The method of claim 19 , further comprising selecting the one or more longitudinal structural members from a beam, a channel, an angle, a tube, or a rod.

22. The method of claim 19 , wherein providing the profiled block comprises molding a material comprising one or more of fiber glass, glass, ceramics, or glass filled thermoplastic polymers.

23. The method of claim 19 , wherein providing the profiled block comprises molding a material comprising one or more of thermoset polymer or silicone.

24. The method of claim 23 , further comprising selecting the thermoset polymer to be a vinyl ester.

25. An apparatus, comprising:

means for electrically insulating having a top surface, wherein the insulating means comprises vinyl ester thermoset polymer and defines one or more voids extending at least partially through an interior of the insulating means; and

means for providing structural support for the insulating means that comprises metal and is disposed within at least one of the one or more voids of the insulating means, wherein the structural support means are made of a material that differs from the insulating means material, and

the insulating means further defines plural pin holes, which are configured to engage pins of one or more resistive elements of a resistor grid, disposed along a length of the top surface of the insulating means and extending into the insulating means.

26. A method of constructing an insulation board for a resistor grid, the method comprising:

providing a profiled block of a high temperature electrical insulator, wherein the profiled block comprises one or more longitudinal voids, wherein the providing further comprises molding a material comprising one or more of vinyl ester thermoset polymer or silicone;

inserting one or more longitudinal structural members in at least one of the one or more longitudinal voids, wherein the cross section of the longitudinal structural members conforms with the profile of the one or more longitudinal voids; and

providing one or more rows of transverse pin holes along the length of the profiled block, for engaging pins of one or more resistive elements of the resistor grid.

27. An apparatus, comprising:

an insulation board having a top surface, wherein the insulation board defines one or more voids extending at least partially through an interior of the insulation board, and wherein the insulation board is made of an electrically insulating material; and

one or more metal longitudinal structural members disposed within at least one of the one or more voids for supporting the insulation board, wherein the one or more metal longitudinal structural members are made of a material that is different from the electrically insulating material, and

the insulation board further defines plural pin holes, which are configured to engage pins of one or more resistive elements of a resistor grid, disposed along a length of the top surface of the insulation board and extending into the insulation board.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2018
From: GENERAL ELECTRIC COMPANY
To: GE GLOBAL SOURCING LLC
Reel/Frame 047736/0140 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2012
From: KRAHN, JOHN RAYMOND
To: GENERAL ELECTRIC COMPANY
Reel/Frame 028202/0041 →