Method for fabrication of configurable systems
View Patent ↗A method to construct configurable systems, the method including: providing a first configurable system including a first die and a second die, where the connections between the first die and the second die include through-silicon-via (“TSV”), where the first die is diced from a first wafer using first dice lines; providing a second configurable system including a third die and a fourth die, where the connections between the third die and the fourth die include through-silicon-via (“TSV”), where the third die is diced from a third wafer using third dice lines; and processing the first wafer and the third wafer utilizing at least 20 masks that are the same; where the first dice lines are substantially different than the third dice lines, and where the second die includes a configurable I/O to connect the first configurable system to external devices.
1. A method to construct configurable systems, the method comprising:
providing a first configurable system comprising a first die and a second die,
wherein the connections between said first die and said second die comprise through-silicon-via (“TSV”),
wherein said first die is diced from a first wafer using first dice lines;
providing a second configurable system comprising a third die and a fourth die,
wherein the connections between said third die and said fourth die comprise through-silicon-via (“TSV”),
wherein said third die is diced from a third wafer using third dice lines; and
processing said first wafer and said third wafer utilizing at least 20 masks that are the same;
wherein said first dice lines are substantially different than said third dice lines, and
wherein said second die comprises a configurable I/O to connect said first configurable system to external devices.
2. The method to construct configurable systems according to claim 1 , wherein said first die is a field programmable gate array (FPGA) die.
3. The method to construct configurable systems according to claim 1 , wherein said fourth die comprises a configurable I/O die.
4. The method to construct configurable systems according to claim 1 , wherein said first die comprises a configurable memory die.
5. The method to construct configurable systems according to claim 1 , wherein said first die comprises a repeating array of functional units.
6. The method to construct configurable systems according to claim 1 , wherein said first die comprises a repeating array of functional units, wherein each of said functional units comprises a micro controller unit (MCU).
7. The method to construct configurable systems according to claim 1 , wherein said first die comprises unused dice lines.
8. The method to construct configurable systems according to claim 1 , wherein said diced comprises an etch step to define dice lines as a post process step.
9. A method to construct configurable systems, the method comprising:
providing a first configurable system comprising a first die and a second die;
wherein the connections from said first die to said second die comprise through-silicon vias (TSV),
wherein said first die is diced from a first wafer using first dice lines,
wherein said first dice lines are selected from a plurality of predefined potential dice lines, and
wherein said first die comprises unused dice lines, and
wherein said second die comprises unused dice lines,
providing a second configurable system comprising a third die and a fourth die,
wherein the connections between said third die and said fourth die comprise through-silicon-vias (“TSV”),
wherein said third die is diced from a third wafer using third dice lines; and
processing said first wafer and said third wafer utilizing at least 20 masks that are the same;
wherein said first dice lines are substantially different than said third dice lines.
10. A method to construct configurable systems according to claim 9 , wherein said second die comprises a configurable memory.
11. A method to construct configurable systems according to claim 9 , wherein said first die is a field programmable gate array (FPGA) die.
12. A method to construct configurable systems according to claim 9 , wherein said first die comprises a configurable I/O die.
13. A method to construct configurable systems, the method comprising:
providing a first configurable system comprising a first die and a second die, wherein the connections between said first die and said second die comprise through-silicon-via (“TSV”),
wherein said first die is diced from a first wafer using first dice lines;
providing a second configurable system comprising a third die and a fourth die,
wherein the connections between said third die and said fourth die comprise through-silicon-via (“TSV”),
wherein said third die is diced from a third wafer using third dice lines; and
processing said first wafer and said third wafer utilizing at least 20 masks that are the same;
wherein said first dice lines are substantially different than said third dice lines, and
wherein said second die comprises a configurable I/O to connect said first configurable system to external devices, and
wherein said fourth die comprises a SerDes circuit.
14. The method to construct configurable systems according to claim 13 , wherein said first die is a field programmable gate array (FPGA) die.
15. The method to construct configurable systems according to claim 13 , wherein said fourth die comprises a configurable I/O die.
16. The method to construct configurable systems according to claim 13 , wherein said first die comprises a configurable memory die.
17. The method to construct configurable systems according to claim 13 , wherein said first die comprises a repeating array of functional units.
18. The method to construct configurable systems according to claim 13 , wherein said first die comprises a repeating array of functional units, and wherein each of said functional units comprises a micro controller unit (MCU).
19. The method to construct configurable systems according to claim 13 , wherein said diced comprises an etch step to define dice lines as a post process step.
20. The method to construct configurable systems according to claim 13 , wherein said first die comprises unused dice lines.