IP Library Granted Patent US 8,878,075
Granted Patent B2
US 8,878,075 · App. 13/472,135 · Granted Nov 4, 2014

Connecting structure and a display device with said connecting structure

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Quick Facts
Patent No.
US 8,878,075
App. No.
13/472,135
Granted
Nov 4, 2014
Kind
B2
Abstract

Providing a connecting structure for connecting first electrodes formed on the upper surface of a first substrate to second electrodes formed on the upper surface of a second substrate glued on the upper surface of the first substrate by an electrically conductive member, wherein the second substrate is smaller in its outer size than the first substrate, the first electrodes are arranged on the first substrate around the periphery of the second substrate, a gap is formed between the first and second substrates at the peripheral edge of the second substrate, an insulating resin is arranged near the first electrodes so as to cover portions of the side surfaces of the second substrate and to fill the gap between the first and second substrates, and the electrically conductive member is arranged over regions leading from the first electrodes through the insulating resin to the second electrodes.

Claims (7)

1. A connecting structure for connecting first electrodes formed on the upper surface of a first substrate to second electrodes formed on the upper surface of a second substrate glued on the upper surface of said first substrate by an electrically conductive member,

wherein said second substrate is smaller in its outer size than said first substrate, said first electrodes are arranged on said first substrate around the periphery of the second substrate, a gap is formed between said first substrate and said second substrate at the peripheral edge of said second substrate, an insulating resin is arranged near said first electrodes so as to cover portions of the side surfaces of said second substrate and to fill the gap between said first substrate and said second substrate, said electrically conductive member is arranged over regions leading from said first electrodes through the upper surface of the insulating resin to said second electrodes, and the plane of said second substrate, which plane is opposed to said first substrate, is provided with a third electrode at least at the end periphery of said second substrate, and

wherein the portions of said third electrodes near said first electrodes are removed.

2. The connecting structure according to claim 1 , wherein said electrically conductive member consists of said insulating resin into which electrically conductive particles are dispersed, the particle size of said electrically conductive particles is set to a value larger than the gap between said first substrate and said second substrate, and in said gap between said first substrate and said second substrate, said electrically conductive particles of said electrically conductive member are not arranged and only said insulating resin is arranged.

3. The connecting structure according to claim 1 , wherein said electrically conductive member is an electrically conductive paste.

4. The connecting structure according to claim 1 , wherein said insulating resin arranged so as to fill said gap between said first substrate and said second substrate becomes a forward tapered shape at the upper surface of the first substrate from the side surfaces of said second substrate.

5. A display device comprising said connecting structure according to claim 1 .

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY NAME AND ADDRESS PREVIOUSLY RECORDED AT REEL: 49675 FRAME: 165. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Sep 11, 2019
From: SHENZHEN TECHVISUM TECHNOLOGIES LIMITED
To: BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 050347/0537 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2019
From: SHENZHEN TECHVISUM TECHNOLOGIES LIMITED
To: BEIHAI HUIKE PHOTOELECTRIC TECHNOLOGY CO., LTD.
Reel/Frame 049675/0165 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2019
From: TIANMA MICRO-ELECTRONICS CO., LTD.
To: SHENZHEN TECHVISUM TECHNOLOGIES LIMITED
Reel/Frame 049644/0278 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2019
From: TIANMA JAPAN, LTD.
To: TIANMA MICRO-ELECTRONICS CO., LTD.
Reel/Frame 049203/0605 →
CHANGE OF NAME Recorded May 15, 2019
From: NLT TECHNOLOGIES, LTD.
To: TIANMA JAPAN, LTD.
Reel/Frame 049188/0536 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2012
From: FUJITA, AKIRA
To: NLT TECHNOLOGIES, LTD.
Reel/Frame 028235/0199 →