IP Library Granted Patent US 9,182,425
Granted Patent B2
US 9,182,425 · App. 13/476,332 · Granted Nov 10, 2015

Probe supporting and aligning apparatus

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Quick Facts
Patent No.
US 9,182,425
App. No.
13/476,332
Granted
Nov 10, 2015
Kind
B2
Abstract

An apparatus for testing electrical characteristics of a device, having one or more testing sites. The apparatus comprises a nonconductive plate having a through-hole. The through-hole is positioned such that it at least partially overlays one of the one or more testing sites when at least a portion of the bottom surface of the nonconductive plate is adjacent to the device to be tested. The apparatus also comprises an adhesive on at least a portion of the bottom surface of the nonconductive plate for attaching the bottom surface of the nonconductive plate to the device to be tested. The apparatus also comprises a probe positioning body protruding from the top surface of the nonconductive plate and having a through-hole. The probe positioning body is positioned such that the through-hole of the probe positioning body at least partially aligns with the through-hole of the nonconductive plate.

Claims (19)

1. A probe supporting apparatus for testing electrical characteristics of a device, the device having one or more testing sites, comprising:

a nonconductive plate having a top surface, a bottom surface, and a substantially frustoconical through-hole, wherein the substantially frustoconical through-hole is positioned such that the substantially frustoconical through-hole at least partially overlays one of the one or more testing sites when at least a portion of the bottom surface of the nonconductive plate is adjacent to the device to be tested;

an adhesive on at least a portion of the bottom surface of the nonconductive plate for attaching the bottom surface of the nonconductive plate to the device to be tested; and

a probe positioning body protruding from the top surface of the nonconductive plate and having a substantially frustoconical through-hole, wherein the probe positioning body is positioned such that the substantially frustoconical through-hole of the probe positioning body at least partially aligns with the substantially frustoconical through-hole of the nonconductive plate for allowing insertion of a probe through both of the substantially frustoconical through-hole of the probe positioning body and the substantially frustoconical through-hole of the nonconductive plate;

wherein the probe positioning body includes a substantially frustoconical wall of substantially uniform thickness protruding from the top surface of the nonconductive plate for supporting the probe inserted through both of the substantially frustoconical through-hole of the probe positioning body and the substantially frustoconical through-hole of the nonconductive plate.

2. The probe supporting apparatus of claim 1 , wherein the probe positioning body is positioned such that the substantially frustoconical through-hole of the probe positioning body at least partially aligns with the substantially frustoconical through-hole of the nonconductive plate, and the substantially frustoconical through-hole of the probe positioning body and the substantially frustoconical through-hole of the nonconductive plate are substantially axially aligned about a central axis.

3. The probe supporting apparatus of claim 2 , wherein the probe positioning body is positioned such that the substantially frustoconical through-hole of the probe positioning body at least partially aligns with the substantially frustoconical through-hole of the nonconductive plate, the substantially frustoconical through-hole of the probe positioning body and the substantially frustoconical through-hole of the nonconductive plate are substantially axially aligned about a central axis, and where a portion of the substantially frustoconical through-hole of the probe positioning body is essentially coplanar with the top surface of the nonconductive plate, the substantially frustoconical through-hole of the probe positioning body and the substantially frustoconical through-hole of the nonconductive plate have substantially equal diameters.

4. The probe supporting apparatus of claim 1 ,

wherein the probe positioning body is positioned such that the substantially frustoconical through-hole of the probe positioning body at least partially aligns with the substantially frustoconical through-hole of the nonconductive plate, and the substantially frustoconical through-hole of the probe positioning body and the substantially frustoconical through-hole of the nonconductive plate are substantially axially aligned about a central axis;

wherein the substantially frustoconical through-hole of the nonconductive plate tapers from a larger diameter to a smaller diameter as the substantially frustoconical through-hole of the nonconductive plate extends from the bottom surface to the top surface of the nonconductive plate, and

wherein the substantially frustoconical wall of substantially uniform thickness protruding from the top surface of the nonconductive plate defines an opening at a top of the probe positioning body having a circumference smaller than a circumference of an opening where the probe positioning body protrudes from the top surface of the nonconductive plate such that the substantially frustoconical through-hole of the probe positioning body tapers from a larger diameter to a smaller diameter as the substantially frustoconical through-hole of the probe positioning body extends from the top surface of the nonconductive plate.

5. The probe supporting apparatus of claim 1 ,

wherein the probe positioning body is positioned such that the substantially frustoconical through-hole of the probe positioning body at least partially aligns with the substantially frustoconical through-hole of the nonconductive plate, and the substantially frustoconical through-hole of the probe positioning body and the substantially frustoconical through-hole of the nonconductive plate are substantially axially aligned about a central axis;

wherein the substantially frustoconical through-hole of the nonconductive plate tapers from a smaller diameter to a larger diameter as the substantially frustoconical through-hole of the nonconductive plate extends from the bottom surface to the top surface of the nonconductive plate, and

wherein the substantially frustoconical wall of substantially uniform thickness protruding from the top surface of the nonconductive plate defines an opening at a top of the probe positioning body having a circumference greater than a circumference of an opening where the probe positioning body protrudes from the top surface of the nonconductive plate such that the substantially frustoconical through-hole of the probe positioning body tapers from a smaller diameter to a larger diameter as the substantially frustoconical through-hole of the probe positioning body extends from the top surface of the nonconductive plate.

6. The probe supporting apparatus of claim 1 , wherein the nonconductive plate comprises a transparent material.

7. The probe supporting apparatus of claim 1 , further comprising clips for attaching the bottom surface of the nonconductive plate to the device to be tested.

8. The probe supporting apparatus of claim 1 , wherein the nonconductive plate and the probe positioning body protruding from the top surface of the nonconductive plate comprise the same material.

9. The probe supporting apparatus of claim 8 , wherein the probe supporting apparatus is formed as one piece, such that the nonconductive plate and the probe positioning body protruding from the top surface of the nonconductive plate are integral.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 050300/0947 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2016
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037696/0522 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 034194/0111 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2012
From: MENG, JIAN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 028241/0037 →