EXTRUDED MATCHING SET RADIATORS
A thermal management system for use in a vacuum is provided including a heat generation device and a heat dissipation device. An extruded first heat transfer panel is mounted to a surface of the heat generation device and an extruded second heat transfer panel is mounted to a surface of the heat dissipation device. The first and second heat transfer panels are positioned between the heat generation device and the heat dissipation device. A portion of the first heat transfer panel and a portion of the second heat transfer panel are interposed.
1 . A thermal management system for use in a vacuum comprising:
a heat generation device;
a heat dissipation device;
an extruded first heat transfer panel mounted to a surface of the heat generation device between the heat generation device and the heat dissipation device; and
an extruded second heat transfer panel mounted to a surface of the heat dissipation device between the heat dissipation device and the heat generation device, wherein a portion of the first heat transfer panel and a portion of the second heat transfer panel are interposed.
2 . The thermal management system according to claim 1 , wherein the first and second extruded heat transfer panels are radiator panels.
3 . The thermal management system according to claim 1 , wherein the heat generation device includes at least one electronic component.
4 . The thermal management system according to claim 1 , wherein the heat dissipation device includes a liquid cooling device.
5 . The thermal management system according to claim 1 , wherein a connector is used to mount the first heat transfer panel to the surface of the heat generation device and the second heat transfer panel to the surface of the heat dissipation device.
6 . The thermal management system according to claim 5 , wherein the connector is a braze.
7 . The thermal management system according to claim 1 , wherein the first heat transfer panel includes a first base and a plurality of first fins extending generally perpendicularly from the first base and the second heat transfer panel includes a second base and a plurality of second fins extending generally perpendicularly from the second base.
8 . The thermal management system according to claim 7 , wherein the plurality of first fins of the first heat transfer device and the plurality of second fins of the second heat transfer device are interposed.
9 . The thermal management system according to claim 1 , wherein the first heat transfer device is mounted to the surface of the heat generation device and the second heat transfer device is mounted to the surface of the heat dissipation device opposite the first heat transfer device.
10 . The thermal management system according to claim 1 , wherein the first heat transfer device and the second heat transfer device are identical.
11 . The thermal management system according to claim 10 , wherein the first heat transfer device and the second heat transfer device are mounted such that the plurality of first fins and the plurality of second fins are equally spaced.
12 . A method of forming a thermal management system for use in a vacuum comprising:
creating an extrusion die having at least a first cut shape;
extruding material into the die to form a first heat transfer panel and a second heat transfer panel;
mounting the first heat transfer panel to a surface of a heat generation device; and
mounting the second heat transfer panel to a surface of a heat dissipation device such that a portion of the first heat transfer panel and a portion of the second heat transfer panel are interposed.
13 . The method according to claim 12 , wherein the first heat transfer panel and the second heat transfer panel are radiator panels.
14 . The method according to claim 12 , wherein the die includes a second cut shape and the first heat transfer panel and the second heat transfer device are extruded at the same time.
15 . The method according to claim 12 , wherein the first heat transfer panel and the second heat transfer panel are identical.
16 . The method according to claim 12 , wherein the first heat transfer panel includes a first base and a plurality of first fins and the second heat transfer panel includes a second base and a plurality of second fins.
17 . The method according to claim 16 , wherein the plurality of first fins and the plurality of second fins are interposed.
18 . The method according to claim 16 , wherein the first heat transfer panel and the second heat transfer panel are mounted such that the plurality of first fins and the plurality of second fins are equally spaced.
19 . The method according to claim 12 , wherein the first heat transfer panel is mounted to the surface of the heat generation device and the second heat transfer panel is mounted to the surface of the heat dissipation device opposite the first heat transfer panel.
20 . The method according to claim 12 , wherein a connector is used to mount the first heat transfer panel to the surface of the heat generation device and the second heat transfer panel to the surface of the heat dissipation device.