IP Library Granted Patent US 8,690,609
Granted Patent B2
US 8,690,609 · App. 13/476,752 · Granted Apr 8, 2014

Method, apparatus and system for positioning and holding electrical contacts, seals and related components

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Quick Facts
Patent No.
US 8,690,609
App. No.
13/476,752
Granted
Apr 8, 2014
Kind
B2
Abstract

A header assembly and method to incorporate electrical contacts and seals into a header are described. The header and method include properly positioning a stack of electrical contact housings and seals or seal assemblies in the header and maintaining the electrical contact housings and the seals in the header with pins inserted in the header from outside the header through axially arranged holes in the header to interface corresponding grooves of the electrical contact housings.

Claims (24)

1. A header assembly for an implantable device, the header assembly comprising:

a header having a bore;

at least one electrical contact ring located in the bore, said at least one electrical contact ring comprising an exterior surface;

at least one seal located in the bore, said at least one seal comprising an exterior surface;

at least one locator pin having a first end and a second end inserted into the header through an opening in the header, which is spaced from an inlet opening of the header, to interface with the electrical contact ring to retain the electrical contact ring and the seal in the bore of the header; and

wherein the locator pin is pressed fit into the header, the at least one electrical contact, or both without a weld to secure the at least one electrical contact axially relative to the header.

2. The header assembly of claim 1 , wherein the header is made from a plastic material.

3. The header assembly of claim 1 , wherein the at least one electrical contact ring includes an outer groove in contact with the locator pin.

4. The header assembly of claim 1 , wherein the at least one electrical contact ring includes an annular inner groove and a spring positioned in the groove.

5. The header assembly of claim 4 , wherein the spring is a canted coil spring.

6. The header assembly of claim 4 , wherein the annular groove comprises two side walls and a bottom wall.

7. The header assembly of claim 1 , wherein the at least one contact ring mechanically engages the at least one seal.

8. The header assembly of claim 1 , wherein the at least one seal comprises at least one inner rib for sealing against a lead.

9. A method of making a header assembly for an implantable device, the method comprising:

forming a header, the header having an inlet and a bore;

installing at least one electrical contact ring comprising an exterior surface and at least one seal comprising an exterior surface in the bore of the header; and

retaining the electrical contact ring and the seal in the bore of the header with a locator pin inserted in the header through a corresponding opening in the header spaced from the inlet to interface with the electrical contact ring; and

wherein the locator pin engages a groove inside the header without a weld to axially locate the at least one electrical contact ring, the at least one seal, or both.

10. The method of claim 9 , wherein the header is constructed from plastic.

11. The method of claim 9 , further comprising forming an outer groove in the at least one electrical contact ring to receive the locator pin.

12. The method of claim 9 , wherein the at least one electrical contact ring includes an annular inner groove and a spring positioned in the groove.

13. The method of claim 12 , wherein the spring is a canted coil spring.

14. The method of claim 12 , wherein the annular groove comprises two side walls and a bottom wall located therebetween.

15. The method of claim 9 , wherein the header has a parting line and is made from at least two housing sections.

Assignments (6)
SECURITY INTEREST Recorded Feb 27, 2025
From: X-MICROWAVE, LLC; TANTALUM PELLET COMPANY, LLC; EVANS CAPACITOR COMPANY, LLC; PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.; RUBBERCRAFT CORPORATION OF CALIFORNIA, LTD.; SWIFT TEXTILE METALIZING LLC; RMB PRODUCTS; BAL SEAL ENGINEERING, LLC; KAMATICS CORPORATION; BEI PRECISION SYSTEMS & SPACE COMPANY, INC.; PAKTRON LLC; OHMEGA TECHNOLOGIES, LLC; TICER TECHNOLOGIES, LLC; CUSTOM INTERCONNECTS, LLC; SANDERS INDUSTRIES HOLDINGS, INC.; AKROFIRE, LLC; KAMAN AEROSPACE CORPORATION; KAMAN CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 070344/0430 →
RELEASE OF INTELLECTUAL PROPERTY SECURITY AGREEMENTS (PATENTS) AT REEL 067175/FRAME 0740 Recorded Feb 27, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: KAMAN CORPORATION; KAMAN AEROSPACE CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC; KAMATICS CORPORATION
Reel/Frame 070347/0014 →
RELEASE OF SECURITY INTEREST Recorded Apr 23, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: KAMATICS CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC
Reel/Frame 067200/0800 →
IP SECURITY AGREEMENT Recorded Apr 22, 2024
From: KAMAN CORPORATION; KAMAN AEROSPACE CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC; KAMATICS CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 067175/0740 →
AMENDED AND RESTATED PATENT COLLATERAL SECURITY AND PLEDGE AGREEMENT Recorded Sep 18, 2020
From: KAMATICS CORPORATION; BAL SEAL ENGINEERING, LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 054304/0388 →
CHANGE OF NAME Recorded Apr 15, 2020
From: BAL SEAL ENGINEERING, INC.
To: BAL SEAL ENGINEERING, LLC
Reel/Frame 052410/0399 →