3-dimensional non-volatile memory device including a selection gate having an L shape
A 3-dimensional (3-D) non-volatile memory device includes a first channel protruding from a substrate, a selection gate formed on sidewalls of the first channel and in an L shape, and a gate insulating layer interposed between the first channel and the selection gate and surrounding the first channel. A method of manufacturing a 3-D non-volatile memory device includes forming first channels protruding from a substrate, forming a first gate insulating layer surrounding the first channels, and forming first selection gates having an L shape on sidewalls of the first channels on which the first gate insulating layers are formed.
1. A 3-dimensional (3-D) non-volatile memory device, comprising:
a channel protruding from a substrate;
a selection gate formed on sidewall of the channel and having an L shape; and
a gate insulating layer interposed between the channel and the selection gate and surrounding the channel; and the selection gate includes a first region surrounding a side wall of the first channel and a second region protruding from the first region.
2. The 3-D non-volatile memory device of claim 1 , wherein impurities are doped onto the top and sidewalls of the channel.
3. The 3-D non-volatile memory device of claim 1 , further comprising memory cells formed over or under the selection gate and stacked along the channel.
4. A 3 -D non-volatile memory device, comprising:
a pair of channels protruding from a substrate;
selection gates formed on sidewalls of each of the channels and having an L shape;
a pipe channel coupled to bottoms of the pair of the channels ;
gate insulating layers interposed between the channels and the selection gates; and
memory cells formed under each of the selection gates and stacked along the channels; and the selection gate includes a first region surrounding a side wall of the first channel and a second region protruding from the first region.
5. The 3-D non-volatile memory device of claim 4 , wherein each of the channels and the pipe channel has a hole formed along a central axis, and the hole is filled with an insulating layer and a conductive plug formed on the insulating layer.
6. A 3-dimensional (3-D) non-volatile memory device, comprising:
a first channel column including a plurality of first channels protruding from a substrate;
a gate line formed on sidewalls of the plurality of the first channels and coupling the first channels included in one first channel column, wherein the gate line has an L shape; and
a plurality of gate insulating layers interposed between the plurality of the first channels and the gate line respectively; and the gate line includes first regions surrounding side walls of the first channels and a second region formed between the first channels and coupling the first regions.
7. The 3-dimensional (3-D) non-volatile memory device of claim 6 , further comprising:
a second channel column including a plurality of second channels.
8. The 3-dimensional (3-D) non-volatile memory device of claim 7 , wherein the gate line includes first region surrounding side walls of the first and second channels and a second region formed between the first and second channels and coupling the first regions.