Sensor assembly
View Patent ↗A multiple axis sensor assembly includes an enclosure and encapsulated microelectromechanical system (MEMS) sensors. The encapsulated sensors are disposed inside the enclosure and are mounted in different orientations, which correspond to different axes of the sensor assembly. A controller of the sensor assembly is disposed in the enclosure and electrically coupled to the MEMS sensors.
1. A multiple axis sensor assembly, comprising:
an enclosure;
encapsulated microelectromechanical system (MEMS) sensors, the encapsulated sensors being disposed inside the enclosure and mounted in different orientations corresponding to different axes of the sensor assembly; and
a controller disposed in the enclosure and electrically coupled to the MEMS sensors.
2. The assembly of claim 1 , wherein the MEMS sensors are identical.
3. The assembly of claim 1 , wherein
a first MEMS sensor of the MEMS sensors comprises a face having electrical connection terminals,
a second MEMS sensor of the MEMS sensors comprises a face having electrical connection terminals,
the face of the first MEMS sensor is mounted to the enclosure, and
a face other than the face of the second MEMS sensor is mounted to the enclosure.
4. The assembly of claim 3 , further comprising a right angle connector to electrically couple the second MEMS sensor to the controller.
5. The assembly of claim 1 , wherein the enclosure comprises at least one conductive layer, further comprising wire bonding to electrically couple the MEMS sensors to the at least one conductive layer.
6. The assembly of claim 1 , wherein the enclosure comprises a tray comprising an opening to receive the MEMS sensors and a lid to close the opening.
7. The assembly of claim 6 , wherein the lid is hermetically sealed to the tray, the assembly further comprising a gas charge disposed inside the enclosure.