Methods for improving adhesion on dielectric substrates
View Patent ↗Various embodiments described herein provide for substrate structures including uniform plating seed layers, and that provide favorable adhesion on dielectric substrate layers. According to some embodiments, a methods for forming a magnetic recording pole is provided comprising: forming an insulator layer; forming a trench in the insulator layer; forming an amorphous seed layer over the insulator layer; forming an adhesion layer over the amorphous seed layer, the adhesion layer comprising a physical vapor deposited (PVD) noble metal; forming a plating seed layer over the adhesion layer, the plating seed layer comprising chemical vapor deposited (CVD) Ru; and forming a magnetic material layer over the plating seed layer.
1. A magnetic recording pole, comprising:
an insulator layer;
an amorphous seed layer disposed over the insulator, wherein the amorphous seed layer comprises TaO x , TiO x , or WO x ;
an adhesion layer disposed over the amorphous seed layer, the adhesion layer comprising a physical vapor deposited (PVD) noble metal;
a plating seed layer disposed over the adhesion layer, the plating seed layer comprising chemical vapor deposited (CVD) RuO 4 ; and
a magnetic material layer disposed over the plating seed layer.
2. The recording medium of claim 1 , wherein the PVD noble metal comprises Ru, Rh, Pd, Ag, Os, Ir, Pt, or Au.
3. The recording medium of claim 1 , wherein the insulator layer comprises alumina.
4. The recording medium of claim 1 , wherein the magnetic material layer comprises NiFe or CoFe.