Light-emitting device and electronic device including substrate having flexibility
It is an object to provide a flexible light-emitting device with long lifetime in a simple way and to provide an inexpensive electronic device with long lifetime using the flexible light-emitting device. A flexible light-emitting device is provided, which includes a substrate having flexibility and a light-transmitting property with respect to visible light; a first adhesive layer over the substrate; an insulating film containing nitrogen and silicon over the first adhesive layer; a light-emitting element including a first electrode, a second electrode facing the first electrode, and an EL layer between the first electrode and the second electrode; a second adhesive layer over the second electrode; and a metal substrate over the second adhesive layer, wherein the thickness of the metal substrate is 10 μm to 200 μm inclusive. Further, an electronic device using the flexible light-emitting device is provided.
1. A light-emitting device comprising:
a substrate having a flexibility;
an adhesive;
an insulating film over the substrate, the insulating film comprising nitrogen and silicon;
a light-emitting element over the insulating film; and
a metal substrate over the light-emitting element,
wherein the adhesive is provided between the light-emitting element and one of the substrate and the metal substrate, and
wherein the insulating film is provided between the substrate having a flexibility and the light-emitting element.
2. The light-emitting device according to claim 1 , wherein a thickness of the metal substrate is greater than or equal to 10 μm and less than or equal to 200 μm.
3. The light-emitting device according to claim 1 , wherein the substrate is capable of transmitting visible light.
4. The light-emitting device according to claim 1 , further comprising:
a second adhesive provided between the light-emitting element and the metal substrate,
wherein the adhesive is provided between the light-emitting element and the substrate.
5. The light-emitting device according to claim 1 , wherein the light-emitting element comprises:
a first electrode;
a second electrode over the first electrode; and
an electroluminescence layer interposed between the first electrode and the second electrode.
6. The light-emitting device according to claim 1 , wherein the metal substrate comprises one selected from the group consisting of stainless steel, aluminum, copper, nickel, and aluminum alloy.
7. The light-emitting device according to claim 1 , wherein the adhesive is interposed between the substrate and the insulating film.
8. The light-emitting device according to claim 1 , further comprising:
a transistor electrically connected to the light-emitting element.
9. An electronic device comprising the light-emitting device according to claim 1 , the electronic device comprising at least one of a FPC, a backlight, an IC chip, a printed wiring board, and a housing.
10. A light-emitting device comprising:
a substrate having a flexibility;
an adhesive;
an insulating film over the substrate, the insulating film comprising nitrogen and silicon, wherein a permeability of the insulating film is smaller than a permeability of the substrate;
a light-emitting element over the insulating film; and
a metal substrate over the light-emitting element,
wherein the adhesive is provided between the light-emitting element and one of the substrate and the metal substrate, and
wherein the insulating film is provided between the substrate having a flexibility and the light-emitting element.
11. The light-emitting device according to claim 10 , wherein a thickness of the metal substrate is greater than or equal to 10 μm and less than or equal to 200 μm.
12. The light-emitting device according to claim 10 , wherein the substrate is capable of transmitting visible light.
13. The light-emitting device according to claim 10 , further comprising:
a second adhesive provided between the light-emitting element and the metal substrate,
wherein the adhesive is provided between the light-emitting element and the substrate.
14. The light-emitting device according to claim 10 , wherein the light-emitting element comprises:
a first electrode;
a second electrode over the first electrode; and
an electroluminescence layer interposed between the first electrode and the second electrode.
15. The light-emitting device according to claim 10 , wherein the metal substrate comprises one selected from the group consisting of stainless steel, aluminum, copper, nickel, and aluminum alloy.
16. The light-emitting device according to claim 10 , wherein the adhesive is interposed between the substrate and the insulating film.
17. The light-emitting device according to claim 10 , further comprising:
a transistor electrically connected to the light-emitting element.
18. An electronic device comprising the light-emitting device according to claim 10 , the electronic device comprising at least one of a FPC, a backlight, an IC chip, a printed wiring board, and a housing.
19. A light-emitting device comprising:
a substrate having a flexibility;
an adhesive;
an insulating film over the substrate, the insulating film comprising nitrogen and silicon;
a light-emitting element over the insulating film;
a transistor electrically connected to the light-emitting element;
a color filter overlapping with the light-emitting element; and
a metal substrate over the light-emitting element,
wherein the adhesive is provided between the light-emitting element and one of the substrate and the metal substrate, and
wherein the insulating film is provided between the substrate having a flexibility and the light-emitting element.
20. The light-emitting device according to claim 19 , wherein a thickness of the metal substrate is greater than or equal to 10 μm and less than or equal to 200 μm.
21. The light-emitting device according to claim 19 , wherein the substrate is capable of transmitting visible light.
22. The light-emitting device according to claim 19 , further comprising:
a second adhesive provided between the light-emitting element and the metal substrate,
wherein the adhesive is provided between the light-emitting element and the substrate.
23. The light-emitting device according to claim 19 , wherein the light-emitting element comprises:
a first electrode;
a second electrode over the first electrode; and
an electroluminescence layer interposed between the first electrode and the second electrode.
24. The light-emitting device according to claim 19 , wherein the metal substrate comprises one selected from the group consisting of stainless steel, aluminum, copper, nickel, and aluminum alloy.
25. The light-emitting device according to claim 19 , wherein the adhesive is interposed between the substrate and the insulating film.
26. The light-emitting device according to claim 19 ,
wherein the color filter is interposed between the light-emitting element and the substrate.
27. An electronic device comprising the light-emitting device according to claim 19 , the electronic device comprising at least one of a FPC, a backlight, an IC chip, a printed wiring board, and a housing.
28. The light-emitting device according to claim 19 , further comprising:
an interlayer insulating film over one of source and drain electrodes of the transistor;
wherein the light-emitting element comprises:
a first electrode over the interlayer insulating film;
a second electrode over the first electrode; and
an electroluminescence layer interposed between the first electrode and the second electrode.
29. The light-emitting device according to claim 19 , further comprising:
a second insulating film over the transistor, and
a second adhesive provided between the light-emitting element and the metal substrate,
wherein the adhesive is provided between the light-emitting element and the substrate,
wherein the light-emitting element comprises:
a first electrode;
a second electrode over the first electrode and the second insulating film; and
an electroluminescence layer interposed between the first electrode and the second electrode, and
wherein the second adhesive is in contact with a side surface of the second insulating film.