Flexible electronic structure
Flexible electronic structure and methods for fabricating flexible electronic structures are provided. An example method includes applying a first layer to a substrate, creating a plurality of vias through the first layer to the substrate, and applying a second polymer layer to the first layer such that the second polymer forms anchors contacting at least a portion of the substrate. At least one electronic device layer is disposed on a portion of the second polymer layer. At least one trench is formed through the second polymer layer to expose at least a portion of the first layer. At least a portion of the first layer is removed by exposing the structure to a selective etchant to providing a flexible electronic structure that is in contact with the substrate. The electronic structure can be released from the substrate.
1. A flexible electronic structure, comprising:
a base polymer layer having a first surface and a second surface, wherein the first surface comprises a plurality of electrically non-conductive anchors;
at least one electronic device layer disposed above a portion of the second surface of the base polymer, the electronic device layer comprising:
two or more device islands; and
at least one stretchable interconnect electrically coupling the two or more device islands; and
a second polymer layer disposed above a portion of the at least one electronic device layer;
wherein at least one anchor of the plurality of electrically non-conductive anchors is disposed beneath at least one of the two or more device islands; and
wherein the flexible electronic structure is configured such that a strain-sensitive layer of the electronic device layer is at a neutral mechanical plane of the flexible electronic structure.
2. The flexible electronic structure of claim 1 , wherein an average width of the plurality of electrically non-conductive anchors is in a range from about 10 μm to about 50 μm.
3. The flexible electronic structure of claim 1 , wherein an average width of the plurality of electrically non-conductive anchors is in a range from about 0.1 μm to about 1000 μm.
4. The flexible electronic structure of claim 1 , wherein at least some of the plurality of electrically non-conductive anchors have a substantially circular cross-section, a substantially hexagonal cross-section, a substantially oval cross-section, a substantially rectangular cross-section, a polygonal cross-section, or a non-polygonal cross-section.
5. The flexible electronic structure of claim 1 , wherein the plurality of electrically non-conductive anchors are formed in a two-dimensional array.
6. The flexible electronic structure of claim 1 , wherein an average width of the plurality of vias is in a range from about 10 μm to about 50 μm.
7. The flexible electronic structure of claim 1 , wherein an average width of the plurality of vias is in a range from about 0.1 μm to about 1000 μm.
8. The flexible electronic structure of claim 1 , wherein the plurality of vias have a pitch with an average separation ranging from about 50 μm to about 1,000 μm.
9. The flexible electronic structure of claim 1 , wherein the plurality of vias have a pitch with an average separation ranging from about 0.2 to about 10,000 μm.
10. The flexible electronic structure of claim 1 , wherein the plurality of vias have a pitch with an average separation ranging from about 200 to about 800 μm.
11. The flexible electronic structure of claim 1 , wherein the second polymer layer comprises polyimide, polyethylene naphthalate, polybenzobisoxazole, benzocyclobutene, siloxane, or a liquid crystal polymer.
12. The flexible electronic structure of claim 1 , wherein the at least one electronic device layer comprises a transistor, a light emitting diode, a transducer, a sensor, a battery, an integrated circuit, a semiconductor, a diode, arrays of electronic components, an optical system, a temperature sensors, a pressure sensor, an electrical-conductivity sensor, a chemical sensor, a resistor, a capacitor, a passive device, a photodiode, a photodetector, an emitter, a receiver, or a transceiver.
13. A flexible electronic structure, comprising:
a base polymer layer having a first surface and a second surface, wherein the first surface comprises a plurality of electrically non-conductive anchors;
at least one electronic device layer disposed above a portion of the second surface of the base polymer, the electronic device layer comprising:
two or more device islands; and
at least one stretchable interconnect electrically coupling the two or more device islands; and
a top polymer layer that is disposed above at least a portion of the at least one electronic device layer,
wherein at least one anchor of the plurality of electrically non-conductive anchors is disposed beneath at least one of the two or more device islands; and
wherein a thickness of the top polymer layer or a thickness of the base layer is configured such that a strain-sensitive layer of the electronic device layer is at a neutral mechanical plane of the flexible electronic structure.
14. The flexible electronic structure of claim 13 , wherein the thickness of the top polymer layer is configured such that the strain-sensitive layer of the at least one electronic device layer is at a neutral mechanical plane of the flexible electronic structure.
15. A flexible electronic structure, comprising:
a base polymer layer having a first surface and a second surface, wherein the first surface comprises a plurality of electrically non-conductive anchors, and wherein at least one of the plurality of electrically non-conductive anchors contacts a substrate;
at least one electronic device layer disposed above a portion of the second surface of the base polymer, the electronic device layer comprising:
two or more device islands; and
at least one stretchable interconnect electrically coupling the two or more device islands; and
a second polymer layer disposed above a portion of the at least one electronic device layer;
wherein at least one anchor of the plurality of electrically non-conductive anchors is disposed beneath at least one of the two or more device islands; and
wherein the flexible electronic structure is configured such that a strain-sensitive layer of the electronic device layer is at a neutral mechanical plane of the flexible electronic structure.
16. The flexible electronic structure of claim 15 , wherein an average width of each anchor of the plurality of electrically non-conductive anchors is in a range from about 10 μm to about 50 μm.
17. The flexible electronic structure of claim 15 , wherein an average width of each anchor of the plurality of electrically non-conductive anchors is in a range from about 0.1 μm to about 1000 μm.
18. The flexible electronic structure of claim 15 , wherein at least some of the plurality of electrically non-conductive anchors have a substantially circular cross-section, a substantially hexagonal cross-section, a substantially oval cross-section, a substantially rectangular cross-section, a polygonal cross-section, or a non-polygonal cross-section.
19. The flexible electronic structure of claim 15 , wherein the plurality of electrically non-conductive anchors are formed in a two-dimensional array.
20. The flexible electronic structure of claim 15 , wherein an average width of each of the plurality of vias is in a range from about 10 μm to about 50 μm.
21. The flexible electronic structure of claim 15 , wherein an average width of each of the plurality of vias is in a range from about 0.1 μm to about 1000 μm.
22. The flexible electronic structure of claim 15 , wherein the plurality of vias have a pitch with an average separation ranging from about 50 μm to about 1,000 μm.
23. The flexible electronic structure of claim 15 , wherein the plurality of vias have a pitch with an average separation ranging from about 0.2 to about 10,000 μm.
24. The flexible electronic structure of claim 15 , wherein the plurality of vias have a pitch with an average separation ranging from about 200 to about 800 μm.
25. The flexible electronic structure of claim 15 , wherein the second polymer layer comprises polyimide, polyethylene naphthalate, polybenzobisoxazole, benzocyclobutene, siloxane, or a liquid crystal polymer.
26. The flexible electronic structure of claim 25 , wherein the at least one electronic device layer comprises a transistor, a LED, a transducer, a sensor, a battery, an integrated circuit, a semiconductor, a diode, arrays of electronic components, an optical system, a temperature sensors, a pressure sensor, an electrical-conductivity sensor, a chemical sensor, a resistor, a capacitor, a passive device, a photodiode, a photodetector, an emitter, a receiver, or a transceiver.
27. A flexible electronic structure, comprising:
a base polymer layer having a first surface and a second surface, wherein the first surface comprises a plurality of electrically non-conductive anchors, and wherein at least one of the plurality of electrically non-conductive anchors contacts a substrate;
at least one electronic device layer disposed above a portion of the second surface of the base polymer, the electronic device layer comprising:
two or more device islands; and
at least one stretchable interconnect electrically coupling the two or more device islands; and
a top polymer layer that is disposed above at least a portion of the at least one electronic device layer
wherein at least one anchor of the plurality of electrically non-conductive anchors is disposed beneath at least one of the two or more device islands; and
wherein a thickness of the top polymer layer or a thickness of the base layer is configured such that a strain-sensitive layer of the electronic device layer is at a neutral mechanical plane of the flexible electronic structure.
28. The flexible electronic structure of claim 27 , wherein the thickness of the top polymer layer is configured such that the strain-sensitive layer of the at least one electronic device layer is at a neutral mechanical plane of the flexible electronic structure.
29. A flexible electronic structure, comprising:
a base polymer layer having a first surface and a second surface, wherein:
the first surface comprises a plurality of electrically non-conductive anchors;
the plurality of electrically non-conductive anchors have a diameter of about 50 μm and have a pitch ranging from about 200 μm to about 800 μm; and
at least one electronic device layer disposed above the second surface of the base polymer layer, the electronic device layer comprising:
two or more device islands; and
at least one stretchable interconnect electrically coupling the two or more device islands; and
a second polymer layer disposed above a portion of the at least one electronic device layer;
wherein at least one anchor of the plurality of electrically non-conductive anchors is disposed beneath at least one of the two or more device islands; and
wherein the flexible electronic structure is configured such that a strain-sensitive layer of the electronic device layer is at a neutral mechanical plane of the flexible electronic structure.