Semiconductor device and method of manufacturing thereof

1. A semiconductor device, comprising:

a substrate having a top surface;

a semiconductor circuit defining a circuit area on the top surface of the substrate; and

an interconnect spaced apart from the circuit area and extending from the top surface into the substrate, the interconnect comprising:

a first sidewall formed of a first electrically insulating material;

a second sidewall formed of a second electrically insulating material, the second sidewall being arranged outside the first sidewall;

a third sidewall formed of an electrically conducting material, the third sidewall being arranged inside the first sidewall,

wherein an opening is formed within the first sidewall and extends laterally between an outer surface of the third sidewall and an inner surface of the second sidewall.

2. The semiconductor device of claim 1 , wherein the interconnect extends from the top surface of the substrate down to a first depth, and the opening extends from the top surface of the substrate down to a second depth, the first depth being larger than the second depth.

3. The semiconductor device of claim 1 , wherein the opening extends from the top surface of the substrate down to a second depth, and the circuit area comprises at least one doped region extending from the top surface of the substrate down to a third depth, the second depth being larger than the third depth.

4. The semiconductor device of claim 3 , wherein the doped region comprises at least one of an n-well and a p-well.

5. The semiconductor device of claim 1 , further comprising:

a first dielectric layer extending over the top surface of the silicon substrate, wherein the opening extends into the first dielectric layer.

6. The semiconductor device of claim 5 , further comprising:

a second dielectric layer extending over the first dielectric layer, the second dielectric layer bridging the opening.

7. The semiconductor device of claim 6 , wherein the second dielectric layer comprises a low k dielectric material.

8. The semiconductor device of claim 1 , wherein the first electrically insulating material is different from the second electrically insulating material.

9. The semiconductor device of claim 1 , the interconnect further comprising a core portion formed of an electrically conducting material, arranged inside the third sidewall, wherein the third sidewall peripherally surrounds the core portion, and wherein the third sidewall and the core portion are different.

10. The semiconductor device of claim 9 , wherein an inner surface of the second sidewall faces in a direction of the core portion and an outer surface of the second sidewall faces in a direction opposite to that of the core portion; and

wherein an inner surface of the third sidewall faces in the direction of the core portion and an outer surface of the third sidewall faces in a direction opposite to that of the core portion.

11. The semiconductor of claim 10 , wherein the inner surface of the second sidewall is in direct contact with an outer surface of the first sidewall.

12. The semiconductor of claim 10 , wherein the outer surface of the third sidewall is in direct contact with an inner surface of the first sidewall.

13. The semiconductor device of claim 1 , the semiconductor circuit comprising at least one of a digital circuit, an analog circuit, a digital transistor, an analog transistor, a digital FET, an analog FET, a PFET, an NFET, a MOSFET, a PMOSFET, and an NMOSFET.

14. The semiconductor device of claim 1 , wherein the first sidewall is formed of silicon dioxide.

15. The semiconductor device of claim 1 , wherein the second sidewall is formed of at least one of silicon nitride, silicon carbide, and silicon carbide nitride.

16. The semiconductor device of claim 1 , wherein the opening extends from the top surface of the silicon substrate down to a second depth of at least 1 micrometer, or at least 10 micrometer, or at least 20 micrometer.

17. A semiconductor device, comprising:

a silicon substrate having a top surface;

a semiconductor circuit defining a circuit area on the top surface of the substrate; and

an interconnect spaced apart from the circuit area and extending from the top surface into the substrate, wherein the interconnect comprises:

a first sidewall formed of a first electrically insulating material;

a second sidewall formed of a second electrically insulating material, the second sidewall being arranged outside the first sidewall and an inner surface of the second sidewall being in direct contact with an outer surface of the first sidewall;

a third sidewall formed of an electrically conducting material, the third sidewall being arranged inside the first sidewall and an outer surface of the third sidewall being in direct contact with an inner surface of the first sidewall,

wherein the interconnect comprises an opening in the first sidewall extending from the top surface of the substrate down to at least a depth of a doped region of the circuit area; and

wherein the opening extends laterally between an outer surface of the third sidewall and the inner surface of the second sidewall.

18. The semiconductor device of claim 17 , wherein the interconnect has a diameter of 10 micrometer or less, or of 5 micrometer or less.

19. The semiconductor device of claim 17 , wherein the opening has a width of ⅕ of a diameter of the interconnect or less.

20. The semiconductor device of claim 17 , wherein the opening extends from the top surface of the substrate down to a second depth, and the circuit area comprises at least one doped region extending from the top surface of the substrate down to a third depth, the second depth being larger than the third depth.

21. The semiconductor device of claim 17 , the interconnect further comprising a core portion formed of an electrically conducting material, arranged inside the third sidewall, wherein the third sidewall peripherally surrounds the core portion and wherein the third sidewall and the core portion are different.

22. The semiconductor device of claim 21 , wherein an inner surface of the second sidewall faces in a direction of the core portion and an outer surface of the second sidewall faces in a direction opposite to that of the core section; and

wherein an inner surface of the third sidewall faces in the direction of the core portion and an outer surface of the third sidewall faces in a direction opposite to that of the core section.

23. A semiconductor device, comprising:

a silicon substrate having a top surface;

a semiconductor circuit defining a circuit area on the top surface of the substrate; and

an interconnect spaced apart from the circuit area and extending from the top surface into the substrate,

wherein the interconnect comprises a first sidewall of a first electrically insulating material peripherally surrounding a core portion, the first sidewall including an opening therein extending from the top surface of the substrate down to at least a depth of a doped region of the circuit area;

a second sidewall formed of a second electrically insulating material, the second sidewall being arranged outside the first sidewall;

a third sidewall formed of an electrically conducting material, the third sidewall being arranged inside the first sidewall, and disposed between the first sidewall and the core portion;

wherein the third side wall and the core portion are different.

24. The semiconductor device of claim 23 , wherein an inner surface of the second sidewall faces in a direction of the core portion and an outer surface of the second sidewall faces in a direction opposite to that of the core section; and

wherein an inner surface of the third sidewall faces in the direction of the core portion and an outer surface of the third sidewall faces in a direction opposite to that of the core section.

25. The semiconductor device of claim 24 , wherein the opening extends laterally between the outer surface of the third sidewall and the inner surface of the second sidewall.