Probe card for testing a semiconductor chip
There is provided a probe card comprising a plurality of probe tips, each being ball-shaped or pillar-shaped and having a top end in contact with each of target chip pads to be tested; a first space converting unit; a second space converting unit; a frame configured to support the second space converting unit; an interposer unit; and a circuit board.
1. A probe card comprising:
a plurality of probe tips, each being ball-shaped or pillar-shaped and having a top end in contact with each of target chip pads to be tested;
a first space converting unit configured to have first wirings formed on a top surface thereof to be electrically connected to a bottom end of each of the probe tips and second wirings formed in multi-layers to be electrically connected to the wirings formed on the top surface;
a second space converting unit configured to have third wirings formed on a top surface thereof to be electrically connected to the second wirings in multi-layers of the first space converting unit and pads disposed on a bottom surface that are electrically connected to the third wirings;
a frame configured to support the second space converting unit;
an interposer unit configured to comprise interposers being located in holes formed in the frame to support the second space converting unit, being electrically connected to the pads of the second space converting unit and providing elasticity; and
a circuit board configured to support the interposer unit and transmit a test signal to the interposers that are electrically connected to the circuit board,
wherein the second space converting unit is configured to be formed of a silicon wafer and have a plurality of via-holes to electrically connect the third wirings and the pads disposed on the bottom surface of the second space converting unit.
2. The probe card of claim 1 , wherein the frame is coupled to at least one of the second space converting unit and the circuit board at a predetermined spacing.
3. The probe card of claim 1 , wherein the plurality of probe tips are coupled to a top surface of a silicon wafer and thus detachable from the first space converting unit and the silicon wafer has a plurality of via-holes to electrically connect the probe tips and the pads on the bottom surface and enables the pads on the bottom surface to be electrically connected to the first wiring.
4. The probe card of claim 1 , wherein the first space converting unit is configured to have a plurality of first via-holes to electrically connect the respective second wirings and the first wirings and a plurality of second via-holes to electrically connect the respective second wirings to pads disposed on a bottom surface of the first space converting unit, and the pads disposed on the first space converting unit are electrically connected to the third wirings.
5. The probe card of claim 1 , wherein the first space converting unit is configured to have multi-layers of polyimide and have at least one of the second wirings formed on an upper surface of each layer.
6. The probe card of claim 1 , wherein the interposers are pogo pins or curved pins that are interposed between the circuit board and the pads disposed on the bottom surface of the second space converting unit and provide elasticity.
7. The probe card of claim 6 , wherein the interposers are curved pins and each of the curved pins is formed by integrating a first straight body to be electrically connected to the pad disposed on the bottom surface of the second space converting unit, a second straight body to be electrically connected to the circuit board, and a curved body electrically connected between the first and second straight bodies to provide elasticity.