Electronic component and method of manufacturing electronic component
View Patent ↗An electronic component comprises an element body and an outer electrode. The element body has a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other. The outer electrode is formed on the end face side of the element body and covers a portion of the main and side faces adjacent to the end face. At least a surface of an electrode portion of the outer electrode located on the side face side thereof is covered with an insulating layer.
1. An electronic component comprising:
an element body having a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other;
an outer electrode, formed on one end face of the pair of end faces, for covering a portion of the main and side faces adjacent to the one end face; and
an insulating layer that covers at least a surface of an electrode portion of the outer electrode located on a side face side of the outer electrode without covering portions of the main faces that are not covered by the outer electrode,
wherein
the electrode portion has a sintered electrode layer;
the insulating layer is directly formed on the sintered electrode layer and completely covers a surface of the sintered electrode layer; and
a portion of the sintered electrode layer is not covered with the insulating layer, and a plating layer is directly formed on the portion of the sintered electrode layer.
2. An electronic component according to claim 1 , wherein the insulating layer is opaque or colored.
3. A package comprising:
the electronic component according to claim 1 ; and
a mounting substrate having a mounting surface,
wherein the electronic component is mounted on the mounting substrate with the side faces perpendicular to the mounting surface.
4. An electronic component comprising:
an element body having a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other;
an outer electrode, formed on one end face of the pair of end faces, for covering a portion of the main and side faces adjacent to the one end face; and
an insulating layer that covers at least a surface of an electrode portion of the outer electrode located on a side face side of the outer electrode without covering portions of the main faces that are not covered by the outer electrode,
wherein
the electrode portion has a sintered electrode layer;
the insulating layer is directly formed on the sintered electrode layer and completely covers a surface of the sintered electrode layer; and
a plating layer is directly formed on a portion of the sintered electrode layer that is not covered with the insulating layer, the plating layer not overlapping the insulating layer.
5. A package comprising:
the electronic component according to claim 4 ; and
a mounting substrate having a mounting surface,
wherein the electronic component is mounted on the mounting substrate with the side faces perpendicular to the mounting surface.