Method for three-dimensional packaging of electronic devices
View Patent ↗An interposer is fabricated from a lamina. A donor body is provided, ions are implanted into a first surface of the donor body to define a cleave plane, a temporary carrier is separably contacted to the donor body, and the lamina is cleaved from the donor body. The lamina has front surface and a back surface, with a thickness from the front surface to the back surface. A via hole is formed in the lamina, where the via hole extends through the thickness of the lamina. The temporary carrier is removed from the lamina, and the lamina may be fabricated into an interposer for three-dimensional integrated circuit packages.
1. A method of fabricating an interposer, the method comprising the steps of:
providing a donor body having a first surface;
implanting ions into the first surface of the donor body to define a cleave plane;
separably contacting a first temporary carrier to the first surface of the donor body;
cleaving a lamina from the donor body at the cleave plane, wherein the cleave plane forms a back surface of the lamina, wherein the first surface of the donor body is a front surface of the lamina, and wherein the lamina has a thickness from the front surface to the back surface;
forming a via hole in the lamina, wherein the via hole extends through the thickness of the lamina;
removing the first temporary carrier from the lamina; and
bonding either the front surface or the back surface of the lamina to a second temporary carrier using a de-bondable adhesive;
wherein the step of removing the first temporary carrier occurs after the step of bonding the lamina to the second temporary carrier; and
wherein the step of forming a via hole in the lamina occurs after the step of removing the first temporary carrier.
2. A method of fabricating an interposer, the method comprising the steps of:
providing a donor body having a first surface;
implanting ions into the first surface of the donor body to define a cleave plane;
separably contacting a first temporary carrier to the first surface of the donor body;
cleaving a lamina from the donor body at the cleave plane, wherein the cleave plane forms a back surface of the lamina, wherein the first surface of the donor body is a front surface of the lamina, and wherein the lamina has a thickness from the front surface to the back surface;
forming a via hole in the lamina, wherein the via hole extends through the thickness of the lamina;
removing the first temporary carrier from the lamina; and
fabricating the lamina into a three-dimensional integrated circuit after the step of forming a via hole, wherein the thickness of the cleaved lamina remains substantially unchanged from the step of cleaving to the step of fabricating.
3. The method of claim 2 wherein the thickness of the lamina remains within 20% deviation of its cleaved thickness.
4. A method of fabricating an interposer, the method comprising the steps of:
providing a lamina having a front surface and a back surface, wherein the lamina has a thickness between the front surface and the back surface, and wherein the thickness is between 15 to 40 microns;
contacting a temporary carrier to either the front or the back surface of the lamina;
forming a via hole in the lamina, wherein the via hole, as initially formed, extends through the thickness of the lamina;
removing the temporary carrier from the lamina; and
fabricating the lamina into a three-dimensional integrated circuit after the step of forming a via hole, wherein the thickness of the cleaved lamina remains substantially unchanged between the step of providing a lamina and the step of fabricating the lamina into a three-dimensional integrated circuit.
5. The method of claim 4 wherein the thickness of the lamina remains within 20% deviation of its provided thickness.