ELECTRONIC DEVICE, OSCILLATOR, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
An electronic device is provided in which alignment of a lid substrate 2 and a base substrate 3 is facilitated to reduce the rate of occurrence of defects. The electronic device according to the invention includes a lid substrate, a base substrate bonded to the lid substrate and forming a cavity hermetically sealed from the outside air between the base substrate and the lid substrate, an electronic element housed in the cavity, and a mold member placed on an outer face of the lid substrate or the base substrate. Thus, warping of the lid substrate or the base substrate is reduced.
1 . An electronic device comprising:
a lid substrate;
a base substrate bonded to the lid substrate and forming a cavity hermetically sealed from the outside air between the base substrate and the lid substrate;
an electronic element housed in the cavity; and
a mold member placed on an outer face of the lid substrate or the base substrate.
2 . The electronic device according to claim 1 , wherein the lid substrate has a recess portion and the recess portion forms the cavity.
3 . The electronic device according to claim 1 , wherein the base substrate has a through electrode passing from an inner face on a side of the cavity to an outer face on a side opposite to the cavity, and the electronic element is electrically connected to the through electrode.
4 . The electronic device according to claim 1 , wherein the lid substrate and the base substrate are bonded together with a bonding material including a metal material interposed between them.
5 . The electronic device according to claim 1 , wherein the electronic element is a crystal vibrator mounted in the form of a cantilever on the inner face of the base substrate.
6 . The electronic device according to claim 1 , wherein the mold member is formed of an epoxy resin.
7 . An oscillator comprising:
the electronic device according to claim 5 ; and
a driving circuit supplying a driving signal to the electronic device.
8 . A method of manufacturing an electronic device comprising:
a recess portion forming step of forming a recess portion in a lid substrate;
a mounting step of mounting an electronic element on a base substrate;
a mold member placing step of placing a mold member on an outer face of the lid substrate or the base substrate; and
a bonding step of bonding the lid substrate to the base substrate with the electronic element housed in the recess portion.
9 . The method of manufacturing the electronic device according to claim 8 , wherein the mold member placing step is performed before the bonding step.
10 . The method of manufacturing the electronic device according to claim 8 , wherein the mold member placing step is performed after the bonding step.
11 . The method of manufacturing the electronic device according to claim 8 , further comprising a through electrode forming step of forming a through electrode in the base substrate,
wherein the mold member placing step is a step of placing the mold member such that the through electrode is exposed on an outer face of the base substrate on a side opposite to a side where the electronic element is mounted.
12 . The method of manufacturing the electronic device according to claim 8 , wherein the recess portion forming step is a step of mounting a plurality of recess portions in the lid substrate, and
the mounting step is a step of mounting a plurality of the electronic elements on the base substrate,
further comprising a splitting step of cutting and splitting a stack formed of the lid substrate and the base substrate bonded together.