Granted Patent B2

US 8,389,315 · App. 13/491,237 · Granted Mar 5, 2013

Abstract

Claims (17)

1. A method for manufacturing a display device, the method comprising the steps of:

forming a circuit part including a drive element over a substrate;

forming a planarization insulating layer on the circuit part;

forming a separator in an area outside a display area in which a plurality of light emitting elements connected to the drive element are formed by removing the planarization insulating layer at a position surrounding the display area;

forming an electrically-conductive layer including a plurality of first electrodes and an auxiliary interconnect on the planarization insulating layer;

forming an aperture-defining insulating layer that insulates the first electrodes from each other and has an aperture through which part of the first electrode is exposed; and

forming a plurality of light emitting elements by stacking the first electrode, an organic layer including a light emitting layer, and a second electrode common to the plurality of light emitting elements in that order over an exposed part of each of the plurality of first electrodes, wherein

in the forming the electrically-conductive layer, the forming the aperture-defining insulating layer, and the forming the light emitting elements, the electrically-conductive layer, the aperture-defining insulating layer, and the plurality of light emitting elements are so formed that, in a whole area inside the separator, at least any of the electrically-conductive layer and the aperture-defining insulating layer intervenes between the planarization insulating layer and the second electrode and between the planarization insulating layer and the organic layer.

2. The method for manufacturing a display device according to claim 1 , wherein

in the forming the circuit part, a contact part that electrically interconnects the auxiliary interconnect and the second electrode is formed by using the same layer as a metal layer included in the drive element,

in the forming the planarization insulating layer, an aperture for leading the auxiliary interconnect formed on the planarization insulating layer to a lower layer is formed above the contact part, and

in the forming the electrically-conductive layer and the forming the aperture-defining insulating layer, the auxiliary interconnect and the aperture-defining insulating layer are so formed that an inner wall surface of the aperture by the planarization insulating layer is covered by at least any of the auxiliary interconnect and the aperture-defining insulating layer.

3. The method for manufacturing a display device according to claim 1 , wherein

in the forming the aperture-defining insulating layer, the aperture-defining insulating layer is so formed as to cover an inner wall surface of an aperture by the planarization insulating layer.

4. The method for manufacturing a display device according to claim 1 , wherein

in the forming the aperture-defining insulating layer, the aperture-defining insulating layer is so formed that coverage of the aperture-defining insulating layer, defined by an expression shown below, is a value in a range from 30% to 100% in an area that is inside the separator and is outside the display area,

(the coverage of the aperture-defining insulating layer)={(covering area of the aperture-defining insulating layer)/(area of the area that is inside the separator and is outside the display area)}100%.   (Expression)

Assignments (6)