HEAT MANAGEMENT IN AN ABOVE MOTHERBOARD INTERPOSER WITH PERIPHERAL CIRCUITS
A computing device has a circuit substrate having a socket, a main processor inserted into the socket, an interposer substrate inserted between the socket and the main processor, the circuit substrate, the socket and the interposer substrate being electrically connected, at least one peripheral circuit on the interposer substrate, and a heat sink thermally coupled to the peripheral circuit.
1 . A computing device, comprising:
a circuit substrate having a socket;
a main processor inserted into the socket;
an interposer substrate inserted between the socket and the main processor, the circuit substrate, the socket and the interposer substrate being electrically connected;
at least one peripheral circuit on the interposer substrate; and
a heat sink thermally coupled to the peripheral circuit.
2 . The computing device of claim 1 , wherein the heat sink thermally couples to the peripheral circuit through a sheet.
3 . The computing device of claim 2 , further comprises a cooler thermally coupled to the heat sink.
4 . The computing device of claim 3 , wherein the cooler couples to the heat sink through a heat pipe.
5 . The computer device of claim 2 , further comprising a copper mounting block and the sheet resides between the copper mounting block and the heat sink.
6 . The computer device of claim 5 , wherein the copper mounting block has fins.
7 . The computer device of claim 1 , wherein the heat sink and the peripheral circuit are in direct contact.
8 . The computer device of claim 7 , wherein the heat sink and the peripheral circuit come into direct contact by flexing the interposer substrate.