Process for preparing episulfide resins
View Patent ↗A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.
1. A process for producing an episulfide resin composition comprising melt reacting a solid reaction mixture of (a) at least one epoxy resin in solid form with (b) at least one sulfur donating compound, wherein the sulfur donating compound comprises thiourea; wherein the episulfide resin composition includes both urea and a solid reaction product and is formed by melt reaction.
2. The process of claim 1 , wherein the at least one sulfur donating compound is in solid form.
3. The process of claim 1 , wherein the reaction is carried out in a melt extruder.
4. The process of claim 1 , wherein the at least one epoxy resin is a solid epoxy resin from a 1.5-type to a 10-type epoxy resin.
5. The process of claim 1 , wherein the molar ratio of the at least one epoxy resin to the sulfur donating compound is from about 1:0.01 to about 1:1.
6. The process of claim 1 , wherein the reaction is carried out at a temperature of from at least about 5° C. above the Tg of the epoxy resin reactant component (a).
7. An episulfide resin composition comprising both a solid reaction product of (a) at least one epoxy resin in solid form with (b) at least one sulfur donating compound without a solvent, wherein the sulfur donating compound comprises thiourea, and a by-product of the sulfur donating compound comprising urea; wherein the episulfide resin composition is formed by reacting through melt extrusion components (a) and (b).
8. The episulfide resin composition product of claim 7 having less than about 1 percent volatile organic compounds (VOCs).
9. The episulfide resin composition product of claim 7 having a chlorine content of less than about 1000 ppm.
10. A powder coating formulation comprising the reaction product of (i) the episulfide resin composition product of claim 7 ; and (ii) a flow modifier.
11. The powder coating formulation of claim 10 , including (iii) a curing agent; (iv) a curing catalyst; (v) a filler; or (vi) a solvent.
12. The episulfide resin composition product of claim 7 , wherein the epoxy resin comprises a reaction product of an aromatic bisphenol and epichlorohydrin.