IP Library Granted Patent US 9,423,185
Granted Patent B2
US 9,423,185 · App. 13/497,189 · Granted Aug 23, 2016

Heat transfer device

Inventors: Hisaaki Yamakage (Minato-ku, JP); Yoshihito Yamada (Minato-ku, JP); Masato Hanada (Minato-ku, JP)
Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
F28D15/0233F16L53/002F16L53/005
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,423,185
App. No.
13/497,189
Granted
Aug 23, 2016
Kind
B2
Abstract

A heat transfer device that allows high-accuracy temperature management of an entire piping system. The heat transfer device transferring heat to the piping system through which a fluid flows includes: a high heat conductive heat transfer block surrounding the piping system; a heat pipe embedded in the heat transfer block along an extension direction of the piping system; and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extension direction of the piping system.

Claims (31)

1. A heat transfer device transferring heat to a piping system through which a fluid flows, comprising:

a high heat conductive heat transfer block surrounding said piping system;

a heat pipe formed in said heat transfer block along an extension direction of said piping system; and

a heating unit applying heat to said heat pipe,

wherein said heat transfer block includes a plurality of divided blocks dividable along the extension direction of said piping system, and

wherein the heat pipe includes an evacuated and decompressed vacuum space and a wick provided on an inner surface of the vacuum space, the wick having capillary force.

2. The heat transfer device according to claim 1 , wherein

said piping system includes a first pipe, a second pipe, and a coupling unit coupling one end of said first pipe and one end of said second pipe, and

said heat pipe extends from the other end of said first pipe to the other end of said second pipe.

3. The heat transfer device according to claim 2 , wherein

said coupling unit is larger in outer diameter than said first pipe and said second pipe, and

a tubular space extending along the extension direction of said piping system is formed at a portion closer to said piping system than said heat pipe in said heat transfer block.

4. The heat transfer device according to claim 1 , wherein

said piping system includes a first pipe, a second pipe, and a coupling unit coupling one end of said first pipe and one end of said second pipe,

said coupling unit is larger in outer diameter than said first pipe and said second pipe, and

said heat pipe includes a first channel embedded along said first pipe and a second channel embedded along said second pipe.

5. The heat transfer device according to claim 4 , wherein said heating unit is in thermal contact with said heat transfer block surrounding said coupling unit.

6. The heat transfer device according to claim 4 , wherein said heating unit includes a first heat source heating an end of said first channel on a side close to said coupling unit, and a second heat source heating an end of said second channel on a side close to said coupling unit.

7. The heat transfer device according to claim 4 , wherein

said heat transfer block includes a first block having said first channel embedded therein, a second block having said second channel embedded therein, and a coupling block surrounding said coupling unit, and

said heating unit is in thermal contact with said coupling block.

8. The heat transfer device according to claim 7 , wherein said heat pipe includes a third channel embedded in said coupling block.

9. The heat transfer device according to claim 1 , wherein said heat pipe is formed in only one of said divided blocks.

10. The heat transfer device according to claim 1 , wherein said heat transfer block has a polygonal outer shape in a cross section orthogonal to the extension direction of said piping system.

11. The heat transfer device according to claim 1 , wherein said evacuated and decompressed vacuum space of the heat pipe is a hollow portion formed within said heat transfer block, and a working fluid retained in said hollow portion.

12. The heat transfer device according to claim 1 , wherein

a groove portion is formed in an outer circumferential surface of said heat transfer block, and

said heat pipe includes a pipe member embedded in the groove portion and evacuated, and a working fluid retained in said pipe member.

13. The heat transfer device according to claim 1 , further comprising

equipment coupled to an end of said piping system, wherein

said heat transfer block surrounds said equipment.

Assignments (3)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
CORPORATE ADDRESS CHANGE Recorded Jun 28, 2016
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 039188/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2012
From: YAMAKAGE, HISAAKI; YAMADA, YOSHIHITO; HANADA, MASATO
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 027908/0874 →
Continuity (1)
Related Publication 20120175083A1 · Jul 12, 2012