IP Library Granted Patent US 8,770,988
Granted Patent B2
US 8,770,988 · App. 13/498,236 · Granted Jul 8, 2014

Connector

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Quick Facts
Patent No.
US 8,770,988
App. No.
13/498,236
Granted
Jul 8, 2014
Kind
B2
Abstract

To provide a connector embedded with a substrate which can be fabricated with fewer working process at a lower cost. A connector 10 includes a substrate 1 with an electronic component 3 mounted thereon, a terminal 4 which is electrically connected to the substrate 1 , and a housing 5 comprised of synthetic resin and attached with the substrate 1 and the terminal 4 . In addition, the electronic component 3 and the terminal 4 are electrically connected to the substrate 1 by reflow soldering using a lead-free solder 2 . The connector 10 is fabricated by insert-molding the substrate 1 and the terminal 4 in the housing 5 . Furthermore, the substrate 1 and the electronic component 3 are embedded in the synthetic resin of the housing 5.

Claims (6)

1. A connector comprising:

a substrate on which an electronic component is mounted;

a terminal which is electrically connected to the substrate; and

a housing comprised of a synthetic resin, to which the substrate and the terminal are attached;

wherein the electronic component mounted on the substrate and a solder junction portion between the electronic component and the terminal are coated by a liquid curable resin, and the substrate and the terminal are insert-molded in the housing,

wherein a linear coefficient expansion of the liquid curable resin is intermediate between a linear coefficient expansion of a material constituting the substrate and a linear coefficient expansion of the synthetic material constituting the housing.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2012
From: FURUKAWA, KOJI
To: YAZAKI CORPORATION
Reel/Frame 027927/0498 →