IP Library Granted Patent US 9,588,041
Granted Patent B2
US 9,588,041 · App. 13/501,250 · Granted Mar 7, 2017

System and method for detection and measurement of interfacial properties in single and multilayer objects

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Quick Facts
Patent No.
US 9,588,041
App. No.
13/501,250
Granted
Mar 7, 2017
Kind
B2
Abstract

A system for determining a material property at an interface between a first layer and a second layer includes a transmitter outputting electromagnetic radiation to the sample, a receiver receiving electromagnetic radiation that was reflected by or transmitted though the sample, and a data acquisition device. The data acquisition device digitizes the electromagnetic radiation to yield waveform data. The waveform data represents the radiation reflected by or transmitted though the sample. The material property to be determined is generally the adhesive strength between the first and second layers.

Claims (53)

1. A non-destructive method for determining a material property at an interface between a first layer and a second layer of a sample, the method comprising:

outputting electromagnetic radiation to the sample;

receiving electromagnetic radiation that was reflected by or transmitted through the sample, wherein the electromagnetic radiation received by the sample is non-destructive to the sample;

digitizing the electromagnetic radiation reflected by or transmitted though the sample to yield waveform data, wherein the waveform data represents the electromagnetic radiation reflected by or transmitted though the sample, the waveform data having a first magnitude, a second magnitude and a third magnitude, wherein each magnitude is a peak or trough;

wherein the first magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to a top surface interface of the first layer, the second magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to the interface between the first and second layers, and the third magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to a bottom surface interface of the second layer; and

determining the material property between the first layer and the second layer of the sample by analyzing the second magnitude and/or the third magnitude;

wherein the material property is adhesive strength; and

determining the adhesive strength between the first layer and the second layer of the sample by analyzing the waveform data to determine if a fourth magnitude is located between the third magnitude and the second magnitude in time.

2. The method of claim 1 , further comprising the step of determining the adhesive strength between the first layer and the second layer of the sample by comparing the second magnitude to a reference magnitude.

3. The method of claim 1 , further comprising the step of determining the adhesive strength between the first layer and the second layer of the sample by comparing the third magnitude to a reference magnitude.

4. The method of claim 1 , further comprising the step of determining the adhesive strength between the first layer and the second layer of the sample by comparing the third magnitude to the second magnitude.

5. The method of claim 1 , wherein the electromagnetic radiation is terahertz radiation.

6. The method of claim 5 , wherein the terahertz radiation is continuous wave terahertz radiation.

7. The method of claim 5 , wherein the terahertz radiation is time-domain terahertz radiation.

8. The method of claim 5 , wherein a frequency of the terahertz radiation is between 25 GH z to 10 TH z .

9. The method of claim 1 , further comprising the step of concluding that there is reduced adhesive strength between the first layer and the second layer when the fourth magnitude is located between the third magnitude and the second magnitude in time.

10. A non-destructive method for determining an adhesive strength at an interface between a first layer and a second layer of a sample, the method comprising:

outputting electromagnetic radiation to the sample, wherein the electromagnetic radiation is non-destructive to the sample;

receiving electromagnetic radiation that was reflected by or transmitted though the sample;

digitizing the electromagnetic radiation reflected by or transmitted though the sample to yield waveform data, wherein the waveform data represents the electromagnetic radiation reflected by or transmitted though the sample, the a waveform data having a first magnitude, a second magnitude and a third magnitude, wherein each magnitude is a peak or trough;

wherein the first magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to a top surface interface of the first layer, the second magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to the interface between the first and second layers, and the third magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to a bottom surface interface of the second layer; and

determining the adhesive strength between the first layer and the second layer of the sample by analyzing the waveform data to determine if a fourth magnitude is located between the third magnitude and the second magnitude in time.

11. The method of claim 10 , further comprising the step of concluding that there is reduced adhesive strength between the first layer and the second layer when the fourth magnitude is located between the third magnitude and the second magnitude in time.

12. The method of claim 10 , wherein the electromagnetic radiation is terahertz radiation.

13. The method of claim 12 , wherein the terahertz radiation is continuous wave terahertz radiation.

14. The method of claim 12 , wherein the terahertz radiation is time-domain wave terahertz radiation.

15. The method of claim 12 , wherein a frequency of the terahertz radiation is between 25 GH z to 10 TH z .

16. A non-destructive system for determining a material property at an interface between a first layer and a second layer of a sample, the system comprising:

a transmitter outputting electromagnetic radiation to the sample, wherein the electromagnetic radiation is non-destructive to the sample;

a receiver receiving electromagnetic radiation that was reflected by or transmitted though the sample;

a data acquisition device configured to digitize the electromagnetic radiation reflected by or transmitted though the sample to yield waveform data, wherein the waveform data represents the electromagnetic radiation reflected by or transmitted though the sample, the waveform data having a first magnitude, a second magnitude and a third magnitude, wherein each magnitude is a peak or trough;

wherein the first magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to a top surface interface of the first layer, the second magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to the interface between the first and second layers, and the third magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to a bottom surface interface of the second layer;

the data acquisition device configured to determine the material property between the first layer and the second layer of the sample by analyzing the second magnitude and/or the third magnitude; and the data acquisition device is further configured to determine an adhesive strength between the first layer and the second layer of the sample by analyzing the waveform data to determine if a fourth magnitude is located between the third magnitude and the second magnitude in time.

17. The system of claim 16 , wherein the material property is adhesive strength.

18. The system of claim 17 , wherein the data acquisition device is further configured to determine the adhesive strength between the first layer and the second layer of the sample by comparing the second magnitude to a reference magnitude.

19. The system of claim 17 , wherein the data acquisition device is further configured to determine the adhesive strength between the first layer and the second layer of the sample by comparing the third magnitude to a reference magnitude.

20. The system of claim 17 , wherein the data acquisition device is further configured to determine the adhesive strength between the first layer and the second layer of the sample by comparing the third magnitude to the second magnitude.

21. The system of claim 16 , wherein the electromagnetic radiation is terahertz radiation.

22. The system of claim 21 , wherein the terahertz radiation is continuous wave terahertz radiation.

23. The system of claim 21 , wherein the terahertz radiation is time-domain terahertz radiation.

24. The system of claim 21 , wherein a frequency of the terahertz radiation is between 25 GH z to 10 TH z .

25. The system of claim 16 , wherein the data acquisition device is further configured to determine that there is reduced adhesive strength between the first layer and the second layer when the fourth magnitude is located between the third magnitude and the second magnitude in time.

26. A non-destructive system for determining an adhesive strength at an interface between a first layer and a second layer of a sample, the system comprising:

a transmitter outputting electromagnetic radiation to the sample, wherein the electromagnetic radiation is non-destructive to the sample;

a receiver receiving electromagnetic radiation that was reflected by or transmitted though the sample;

a data acquisition device configured to digitize the electromagnetic radiation reflected by or transmitted though the sample to yield waveform data, wherein the waveform data represents the radiation reflected by or transmitted though the sample, the waveform data having a first magnitude, a second magnitude and a third magnitude, wherein each magnitude is a peak or trough;

wherein the first magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to a top surface interface of the first layer, the second magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to the interface between the first and second layers, and the third magnitude represents a reflected or transmitted portion of the electromagnetic radiation provided to a bottom surface interface of the second layer; and

the data acquisition device configured to determine the adhesive strength between the first layer and the second layer of the sample by analyzing the waveform data to determine if a fourth magnitude is located between the third magnitude and the second magnitude in time.

27. The system of claim 26 , wherein the data acquisition device is further configured to determine that there is reduced adhesive strength between the first layer and the second layer when the fourth magnitude is located between the third magnitude and the second magnitude in time.

28. The system of claim 26 , wherein the electromagnetic radiation is terahertz radiation.

29. The system of claim 28 , wherein the terahertz radiation is continuous wave terahertz radiation.

30. The system of claim 28 , wherein the terahertz radiation is time-domain wave terahertz radiation.

31. The system of claim 28 , wherein a frequency of the terahertz radiation is between 25 GH z to 10 TH z .

Assignments (10)
RIDER TO SECURITY AGREEMENT – PATENTS Recorded Jul 20, 2024
From: LUNA INNOVATIONS INCORPORATED; LUNA TECHNOLOGIES, INC.; GENERAL PHOTONICS CORP.
To: WHITE HAT LIGHTNING OPPORTUNITY LP (THE “AGENT”)
Reel/Frame 068465/0055 →
SECURITY INTEREST Recorded Mar 28, 2022
From: LUNA INNOVATIONS INCORPORATED
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 059525/0575 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: TERAMETRIX LLC
To: LUNA INNOVATIONS INCORPORATED
Reel/Frame 056356/0234 →
SECURITY INTEREST Recorded Mar 4, 2021
From: LUNA INNOVATIONS INCORPORATED; FORMER LUNA SUBSIDIARY, INC.; GENERAL PHOTONICS CORP.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 056455/0331 →
CHANGE OF NAME Recorded Feb 4, 2021
From: PICOMETRIX, LLC
To: TERAMETRIX LLC
Reel/Frame 055145/0911 →
RELEASE OF SECURITY INTEREST Recorded Aug 4, 2017
From: PARTNERS FOR GROWTH III, L.P.
To: ADVANCED PHOTONIX, INC.; PICOMETRIX, LLC
Reel/Frame 043197/0862 →
SECURITY AGREEMENT Recorded May 19, 2015
From: ADVANCED PHOTONIX, INC.; PICOMETRIX, LLC
To: SILICON VALLEY BANK
Reel/Frame 035719/0460 →
SECURITY INTEREST Recorded Mar 12, 2014
From: PICOMETRIX, LLC
To: SILICON VALLEY BANK
Reel/Frame 032420/0795 →
SECURITY AGREEMENT Recorded Feb 12, 2013
From: PICOMETRIX, LLC
To: PARTNERS FOR GROWTH III, L.P.
Reel/Frame 029800/0507 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2012
From: WHITE, JEFFRY S.; FICHTER, GREGORY D.; DULING, IRL; ZIMDARS, DAVID
To: PICOMETRIX, LLC
Reel/Frame 028761/0116 →