IP Library Granted Patent US 8,815,473
Granted Patent B2
US 8,815,473 · App. 13/501,446 · Granted Aug 26, 2014

Generalization of shot definitions for mask and wafer writing tools

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Quick Facts
Patent No.
US 8,815,473
App. No.
13/501,446
Granted
Aug 26, 2014
Kind
B2
Abstract

Techniques for reducing the number of shots required by a radiation beam writing tool to write a pattern, such as fractured layout design, onto a substrate. One or more apertures are employed by a radiation beam writing tool to write a desired pattern onto a substrate using L-shaped images, T-shaped images, or some combination of both. By reducing the number of shots required to write a pattern onto a substrate, various implementations of the invention may reduce the write time and/or write complexity of the write process.

Claims (13)

1. A method of writing patterns onto a substrate, comprising

projecting a beam of radiation through only a portion of at least one aperture onto a substrate; and

arranging the beam of radiation relative to the at least one aperture to form a plurality of images on the substrate, such that at least a portion of the images have compound-trapezoidal concave shapes.

2. The method recited in claim 1 , wherein the compound-trapezoidal concave shapes include compound-rectangular concave shapes.

3. The method recited in claim 2 , wherein the compound-trapezoidal concave shapes include L-shapes.

4. The method recited in claim 2 , wherein the compound-trapezoidal concave shapes include cross shapes.

5. The method recited in claim 2 , wherein the compound-trapezoidal concave shapes include T-shapes.

6. The method recited in claim 1 , wherein the substrate is a blank photolithographic mask.

7. The method recited in claim 1 , wherein the substrate is a semiconductor device substrate.

8. The method recited in claim 1 , wherein the substrate is a microelectromechanical system substrate.

9. The method recited in claim 1 , further comprising arranging the beam of radiation relative to the at least one aperture by

directing a first portion of the beam of radiation through a first aperture to control sizes of the images, and

directing a second portion of the beam of radiation through only a portion of a second aperture to control shapes of the images.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Jun 24, 2021
From: MENTOR GRAPHICS CORPORATION; SIEMENS INDUSTRY SOFTWARE INC.
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 056647/0440 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2015
From: SAHOURIA, EMILE; SCHULZE, STEFFEN
To: MENTOR GRAPHICS CORPORATION
Reel/Frame 036486/0978 →