IP Library Granted Patent US 9,200,123
Granted Patent B2
US 9,200,123 · App. 13/504,492 · Granted Dec 1, 2015

Production method of thermoplastic resin composition, molded body, and light emission body

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Quick Facts
Patent No.
US 9,200,123
App. No.
13/504,492
Granted
Dec 1, 2015
Kind
B2
Abstract

Disclosed is a production method of a thermoplastic resin composition comprising: compounding 0.001 to 50 parts by mass of a metal complex (B) with respect to 100 parts by mass of a thermoplastic resin (A), and kneading it under a condition of a kneading temperature of 225 to 300° C. and of a kneading time of 0.5 to 20 minutes, wherein a metal of the metal complex (B) is a metal except for zinc; a molded body obtained by molding the thermoplastic resin composition which is obtained by the production method; and a light emission body using the molded body.

Claims (15)

1. A light emission body using a molded body obtained by molding a thermoplastic resin composition which is obtained by the following method:

the method comprising:

combining a thermoplastic acrylic resin (A) and from 2.5 to 50 parts by mass of a metal complex (B) with respect to 100 parts by mass of the thermoplastic acrylic resin (A), thereby forming a mixture, and

kneading the mixture at a temperature of from 225 to 300° C. for 5 to 30 minutes, thereby forming the thermoplastic resin composition,

wherein a metal of the metal complex (B) is a metal except for zinc, and

wherein the metal complex (B) is at least one complex selected from the group consisting of aluminum acetylacetonate and aluminum hexafluoroacetylacetonate,

wherein the thermoplastic acrylic resin (A) is polymethyl methacrylate, and

wherein the mixture comprises from 2.5 to 5 parts by mass of the metal complex (B) based on 100 parts by mass of the thermoplastic acrylic resin (A).

2. The light emission body according to claim 1 , wherein the mixture comprises from 2.5 to 20 parts by mass of the metal complex (B) with respect to 100 parts by mass of the thermoplastic acrylic resin (A).

3. The light emission body according to claim 1 , wherein the mixture comprises from 2.5 to 10 parts by mass of the metal complex (B) with respect to 100 parts by mass of the thermoplastic acrylic resin (A).

4. The light emission body according to claim 1 , wherein the thermoplastic resin composition further comprises at least one additive selected from the group consisting of a plasticizer, a lubricant, a stabilizer, an oxidant inhibitor, an ultraviolet absorber, and a mold release agent.

5. The light emission body according to claim 1 , wherein the mixture is kneaded at the temperature of from 240 to 290° C.

6. The light emission body according to claim 1 , wherein the metal complex (B) is aluminum hexafluoroacetylacetonate.

7. The light emission body according to claim 1 , wherein the metal complex (B) is aluminum acetylacetonate.

8. The light emission body according to claim 1 , wherein the mixture comprises from 2.5 to 10 parts by mass of the metal complex (B) with respect to 100 parts by mass of the thermoplastic acrylic resin (A), and the mixture is kneaded at the temperature of from 240 to 290° C.

Assignments (2)
CHANGE OF NAME Recorded Sep 5, 2017
From: MITSUBISHI RAYON CO., LTD.
To: MITSUBISHI CHEMICAL CORPORATION
Reel/Frame 043750/0834 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2012
From: NIINO, HIROSHI
To: MITSUBISHI RAYON CO., LTD.
Reel/Frame 028135/0600 →