Saw wire

1. A saw wire comprising:

a steel wire having a steel strand and a plating layer formed on a surface of the steel strand;

an abrasive fixed to the steel wire by a fixing part; and

an intermetallic compound on an interface between the abrasive and the fixing part, wherein:

the steel strand contains, in mass %,

C: 0.8% to 1.2%,

Si: 0.02% to 2.0%,

Mn: 0.1% to 1.0%,

Cr: 0.5% or less,

P: 0.015% or less,

S: 0.015% or less, and

N: 0.01% or less,

with the balance being Fe and an inevitable impurity;

tensile strength of the steel strand is 3500 MPa or more; and

the fixing part includes an Sn-based solder containing Zn or Ag,

wherein the plating layer gets into the steel strand; and

wherein the Sn-based solder has a melting point of 350° C. or below.

2. The saw wire according to claim 1 , wherein the steel strand further contains, in mass %, at least one kind selected from a group consisting of

Ni: 1.0% or less,

Cu: 0.5% or less,

Mo: 0.5% or less,

V: 0.5% or less, and

B: 0.0050% or less.

3. The saw wire according to claim 1 , wherein the plating layer contains at least one of Zn and Cu.

4. The saw wire according to claim 3 , wherein a getting depth of the plating layer into the steel strand is 0.5 μm to 5 μm.

5. The saw wire according to claim 1 or 4 , comprising a covering layer on a surface of the abrasive and including a layer of Ni or Cu.

6. The saw wire according to claim 5 , wherein the covering layer comprises a base layer of Ti or Cr provided closer to the abrasive than the layer of Ni or Cu is.

7. The saw wire according to claim 1 or 4 , comprising a covering layer on a surface of the abrasive and including a layer of Ni, wherein

the Sn-based solder is a Sn—Ag-based solder containing 0.5 mass % to 5.0 mass % Ag, and

the intermetallic compound contains Sn.

8. The saw wire according to claim 7 , wherein the Sn—Ag-based solder contains a Ag 3 Sn-based intermetallic compound dispersed in a matrix of the Sn—Ag-based solder and having a plate shape with a 1 μm to 2 μm thickness or a string shape with a 1 μm to 2 μm diameter.

9. The saw wire according to claim 7 , wherein the Sn—Ag-based solder further contains at least one of Fe: 0.01 mass % to 0.5 mass % and Ni: 0.01 mass % to 0.5 mass %.

10. The saw wire according to claim 7 , wherein the intermetallic compound further contains Ni.

11. The saw wire according to claim 10 , wherein composition of the intermetallic compound is expressed by Ni 3 Sn 4 , Ni 3 Sn 2 , or Sn (1-x-y) Ni x Cu y (0.1≦x≦0.7, 0.01≦y≦0.5).

12. The saw wire according to claim 1 or 4 , wherein

the Sn-based solder is a Sn—Zn-based solder containing Zn, and

the intermetallic compound contains at least one of Sn and Zn.

13. The saw wire according to claim 12 , wherein a content of Zn in the Sn—Zn-based solder is 1 mass % to 35 mass %.

14. The saw wire according to claim 12 , wherein

composition of the Sn—Zn-based solder is expressed by Sn—Zn—X,

X is at least one kind selected from Bi, Ni, Cu, Fe, Sb, Pb, In, and Ag, and

a content of the X is 0.5 mass % to 5 mass %.

15. The saw wire according to claim 12 , wherein the intermetallic compound contains at least one kind selected from a group consisting of a Ni—Sn-based intermetallic compound, a Ni—Zn-based intermetallic compound, a Ni—Sn—Zn-based intermetallic compound, a Cu—Sn-based intermetallic compound, a Cu—Sn—Zn-based intermetallic compound, and a Cu—Zn-based intermetallic compound.

16. The saw wire according to claim 12 , wherein the Sn—Zn-based solder includes a Zn precipitate in a plate shape or a needle shape dispersed in a matrix of the Sn—Zn-based solder.