IP Library Granted Patent US 8,728,837
Granted Patent B2
US 8,728,837 · App. 13/506,910 · Granted May 20, 2014

Enhancing uniformity of slab region thickness in optical components

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,728,837
App. No.
13/506,910
Granted
May 20, 2014
Kind
B2
Abstract

A method of forming an optical device includes generating a device precursor having a layer of a light-transmitting medium on a base. The method also includes forming an etch stop on the layer of light-transmitting medium. An active medium is grown on the etch stop and on the light-transmitting medium such that the light-transmitting medium is between the base and the grown active medium. The grown active medium is etched down to the etch stop so as to define a ridge in the active medium. The ridge of active medium defines a portion of a component waveguide that will guide a light signal through an active component on the device.

Claims (20)

1. A method of forming an optical device, comprising:

generating a device precursor having a layer of a light-transmitting medium on a base;

forming an etch stop on the layer of light-transmitting medium;

growing an active medium on the etch stop and on the light-transmitting medium such that the light-transmitting medium is between the base and the grown active medium; and

etching the grown active medium down to the etch stop so as to define a ridge in the active medium, the ridge of active medium defining a portion of a component waveguide configured to guide a light signal through an active component on the device.

2. The method of claim 1 , wherein the etch stop is formed such that the etch stop protects a portion of the light-transmitting medium while leaving exposed another portion of the light-transmitting medium.

3. The method of claim 1 , wherein the active medium is grown on the exposed portion of the light-transmitting medium.

4. The method of claim 3 , wherein the ridge of the active medium directly contacts the light-transmitting medium.

5. The method of claim 1 , wherein a portion of the layer of light-transmitting medium extends outwards from under the ridge of active medium.

6. The method of claim 1 , further comprising:

growing a second layer of the light-transmitting medium on the layer of the light-transmitting medium, the second layer being grown before the active medium is grown.

7. The method of claim 6 , wherein growing the second layer of the light-transmitting medium includes growing the second layer of the light-transmitting medium on the etch stop.

8. The method of claim 7 , further comprising:

etching the portion of the second layer of the light-transmitting medium down to the etch stop so as to expose at least a portion of the etch stop.

9. The method of claim 8 , wherein the active medium is grown on the exposed portion of the etch stop.

10. The method of claim 9 , wherein the light-transmitting medium is silicon and the active medium includes germanium.

11. The method of claim 6 , further comprising:

etching the light-transmitting medium after growing the second layer of the light-transmitting medium, the etch of the light-transmitting medium defining a ridge a ridge in the light-transmitting medium, the ridge of light-transmitting medium defining a portion of a device waveguide that is aligned with the component waveguide such that the component waveguide and the device waveguide exchange light signals.

12. The method of claim 11 , wherein the device waveguide and the component waveguide are butt-coupled.

13. The method of claim 1 , wherein the active component is selected from a group consisting of a light sensor and an optical modulator.

Assignments (6)
MERGER Recorded Aug 16, 2023
From: MELLANOX TECHNOLOGIES SILICON PHOTONICS INC.
To: MELLANOX TECHNOLOGIES, INC.
Reel/Frame 064602/0330 →
RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL AT REEL/FRAME NO. 37897/0418 Recorded Jul 13, 2018
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MELLANOX TECHNOLOGIES SILICON PHOTONICS INC.
Reel/Frame 046542/0669 →
PATENT SECURITY AGREEMENT Recorded Feb 23, 2016
From: MELLANOX TECHNOLOGIES SILICON PHOTONICS INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037897/0418 →
CHANGE OF NAME Recorded Jan 19, 2016
From: KOTURA, INC.
To: MELLANOX TECHNOLOGIES SILICON PHOTONICS INC.
Reel/Frame 037560/0263 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2014
From: FONG, JOAN; QIAN, WEI; FENG, DAZENG; ASGHARI, MEHDI
To: KOTURA, INC.
Reel/Frame 032342/0648 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2012
From: FONG, JOAN; QIAN, WEI; FENG, DAZENG; ASGHARI, MEHDI
To: KOTURA, INC.
Reel/Frame 028608/0797 →