Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.
1. A support structure for supporting a semiconductor device during a bonding operation, the support structure comprising:
a body portion, the body portion defining an upper surface configured to support a semiconductor device during a bonding operation, the upper surface defining a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation,
wherein the constraining feature includes a raised portion raised above the upper surface to constrain the portion of the semiconductor device during the bonding operation.
2. The support structure of claim 1 further comprising a base portion wherein the body portion is secured to the base portion during the bonding operation.
3. The support structure of claim 2 wherein the base portion is formed from a first material and the body portion is formed from a second material, the second material being different from the first material.
4. The support structure of claim 3 wherein the base portion is formed from a metallic material and the body portion is formed from an insulative material.
5. The support structure of claim 3 wherein the body portion is formed from a ceramic material.
6. The support structure of claim 3 further comprising a compliant material between the body portion and the base portion.
7. The support structure of claim 2 further comprising a compliant material between the body portion and the base portion.
8. The support structure of claim 1 wherein support structure is an anvil configured for use on a wedge bonding machine.
9. The support structure of claim 1 wherein the raised portion includes substantially parallel raised features to constrain the portion of the semiconductor device during the bonding operation.
10. The support structure of claim 1 wherein the raised portion defines a valley to constrain the portion of the semiconductor device during the bonding operation.
11. The support structure of claim 1 wherein the raised portion includes a plurality of wall portions to at least partially surround, and thereby constrain, the portion of the semiconductor device during the bonding operation.
12. The support structure of claim 1 wherein the semiconductor device includes a leadframe, and wherein the portion of the semiconductor device constrained by the raised feature includes a portion of the leadframe.
13. The support structure of claim 12 wherein the portion of the leadframe constrained by the raised feature includes at least one of a lead, a tie bar, a heat sink, and a die paddle of the leadframe.
14. The support structure of claim 1 wherein the semiconductor device includes a leadframe, and wherein the portion of the semiconductor device constrained during the bonding operation by the constraining feature includes a portion of the leadframe.
15. The support structure of claim 14 wherein the portion of the leadframe constrained by the constraining feature includes at least one of a lead and a tie bar of the leadframe.
16. The support structure of claim 1 wherein the constraining feature is configured to constrain the portion of the semiconductor device in at least one direction.
17. The support structure of claim 16 wherein the at least one direction is a horizontal direction.
18. The support structure of claim 16 wherein the at least one direction includes a direction of ultrasonic scrubbing of a bonding tool motion of a wire bonding machine.
19. The support structure of claim 16 wherein the at least one direction includes at least two directions.