Porous SiO
A porous SiO2 xerogel is produced using temporary pore fillers or solid skeletal supports, which are removed by thermal oxidation at the end of the production process (e.g. carbon or organic), by means of a sol-gel-process by subcritical drying of the gel. The SiO 2 xerogel includes pores having a pore size from more than 50 nm to less than 1000 nm. The SiO 2 xerogel has a density of less than 400 kg/m 3 , a carbon content of less than 10%, a thermal conductivity at 800° C. below 0.060 W/m*K, a thermal conductivity at 400° C. below 0.040 W/m*K, and a thermal conductivity at 200° C. below 0.030 W/m*K.
1. A non-silylated porous SiO 2 xerogel, comprising:
pyrolyzed carbon residue, the pyrolyzed carbon residue comprising less than 10% by weight of the non-silylated porous SiO 2 xerogel;
the SiO 2 -xerogel having a density of less than 400 kg/m 3 , a thermal conductivity at 800° C. below 0.060 W/m*K, a thermal conductivity at 400° C. below 0.040 W/m*K, a thermal conductivity at 200° C. below 0.030 W/m*K, and a plurality of pores, the pores having a pore size from more than 50 nm to less than 1000.
2. The SiO 2 xerogel of claim 1 , wherein the pores have a pore size of smaller than 500 nm.
3. The SiO 2 xerogel of claim 1 , wherein the pores have a pore size of smaller than 300 nm.
4. The SiO 2 xerogel of claim 1 , wherein the pores have a pore size of less than 100 nm.
5. The SiO 2 xerogel of claim 1 , having a density of less than 290 kg/m 3 .
6. The SiO 2 xerogel of claim 1 , having a density of less than 200 kg/m 3 and a carbon content of less than 5%.
7. The SiO 2 xerogel of claim 1 , having a carbon content of less than 5%.
8. The SiO 2 xerogel of claim 1 , having an IR extinction greater than 50 m 2 /g in the absence of additional pigments.
9. The SiO 2 xerogel of claim 7 , having an IR extinction of greater than 80 m 2 /g in the presence of additional pigments.
10. The SiO 2 xerogel of claim 1 , wherein the xerogel is a member selected from the group consisting of a monolithic molded body, a granulate, and a powder.
11. The SiO 2 xerogel of claim 1 , having a fiber content of less than 5% by weight.
12. The SiO 2 xerogel of claim 1 for use as a noncombustible or nonflammable, transparent or translucent or opaque thermal insulation, as a thermal insulation offering mechanical support, catalyst support, filter, adsorber, noncombustible or nonflammable, transparent or translucent or opaque lightweight construction element, dielectric for electronic components, as a controlled or rapid drug release system, as a coating allowing utilization of thermodiffusion processes, as a casting mold, as a support for sensor molecules in sensor technology, for sound damping, for humidity control or as a matrix material for composites.
13. The SiO 2 xerogel of claim 1 , wherein the SiO 2 xerogel is exposed to an application temperature in excess of 250° C.
14. A composition comprising:
a non-silylated porous SiO 2 xerogel characterized by a density of less than 400 kg/m 3 , a thermal conductivity at 800° C. below 0.060 W/m*K, a thermal conductivity at 400° C. below 0.040 W/m*K, a thermal conductivity at 200° C. below 0.030 W/m*K, a modulus of elasticity greater than 5 MPa, and having a plurality of pores, the pores having a pore size from more than 50 nm to less than 1000 nm;
wherein the non-silylated porous SiO 2 xerogel is prepared by a process comprising:
forming a SiO 2 xerogel around solid organic particles;
drying the SiO 2 xerogel using a subcritical drying process; and
pyrolyzing the SiO 2 xerogel at a temperature above 300° C. sufficient to cause the solid organic particles to form a pyrolyzed carbon residue, the pyrolyzed carbon residue comprising less than 10% by weight of the non-silylated porous SiO 2 xerogel.