Composite compositions
View Patent ↗A curable resin composition for composites and electrical laminates including (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material; wherein the composite or electrical laminate has a balance of properties including a combination of (a) a Tg of at least about 150° C.; and (b) a water uptake of less than about 2.5 wt %.
1. A curable resin composition for composites and electrical laminates comprising (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material;
wherein the thermoset resin composition comprises an advanced epoxy resin composition represented by the following general Formula II:
wherein R a is a hydrogen or methyl group, R 1 and R 2 , independently from each other, each represents a hydrogen atom, a halogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted aralkyl group; a nitrile group; a nitro group; a substituted or unsubstituted alkoxy group; X is CH 2 , CH(R 3 ), or C(R 3 )(R 4 ); m is an integral number between 8 and 20; R 3 and R 4 , independently from each other, each represents a hydrogen atom, a halogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted aralkyl group; p and y are integers having a value from 1 to about 20; Q is a hydrocarbylene moiety, and each Z is independently selected from the group consisting of O, S, —NR b , wherein R b is a hydrocarbyl moiety.
2. The composition of claim 1 , wherein the reinforcing material comprise high strength filaments or fibers.
3. The composition of claim 1 , wherein the at least one thermoset resin composition further comprises a thermosetting resin component selected from the group consisting of epoxy resins, isocyanate resins, (meth)acrylic resins, phenolic resins, vinylic resins, styrenic resins, polyester resins, and mixtures thereof.
4. The composition of claim 1 , further comprising at least one of: (IV) an epoxy resin different from Formula I; (V) a filler; (VI) a flame retardant; (VII) a catalyst; and (VIII) a solvent.
5. The composition of claim 1 , wherein component (I) comprises from about 20 percent by weight to about 98 percent by weight based on total weight of the composition; and wherein component (II) comprises from about 2 percent by weight to about 50 percent by weight based on total weight of the composition.
6. A composite or a laminate article made from the composition of claim 1 .
7. The article of claim 6 , wherein the article is a printed wiring board, an electrical or electronic casting, an electrical or electronic potting, an electrical or electronic encapsulation, or an electrical laminate.
8. A curable resin composition for composites and electrical laminates comprising (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material;
wherein the thermoset resin composition comprises an advanced active hydrogen-functional resin composition represented by the following general Formula III:
wherein R a is a hydrogen or methyl group, R 1 and R 2 , independently from each other, each represents a hydrogen atom, a halogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted aralkyl group; a nitrile group; a nitro group; a substituted or unsubstituted alkoxy group; X is CH 2 , CH(R 3 ), or C(R 3 )(R 4 ); m is an integral number between 8 and 20; R 3 and R 4 , independently from each other, each represents a hydrogen atom, a halogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted aralkyl group; and n is an integer having a value from 0 to about 10, Q is a hydrocarbylene moiety, Z is independently selected from the group consisting of O, S, —NR b , wherein R b is a hydrocarbyl moiety; and p is an integer having a value from 1 to about 20; y 1 is an integer having a value from 0 to about 20; and Z 1 is Z—H.
9. The composition of claim 8 , wherein the reinforcing material comprise high strength filaments or fibers.
10. The composition of claim 8 , wherein the at least one thermoset resin composition further comprises a thermosetting resin component selected from the group consisting of epoxy resins, isocyanate resins, (meth)acrylic resins, phenolic resins, vinylic resins, styrenic resins, polyester resins, and mixtures thereof.
11. The composition of claim 8 , further comprising at least one of: (IV) an epoxy resin different from Formula I; (V) a filler; (VI) a flame retardant; (VII) a catalyst; and (VIII) a solvent.
12. The composition of claim 8 , wherein component (I) comprises from about 20 percent by weight to about 98 percent by weight based on total weight of the composition; and wherein component (II) comprises from about 2 percent by weight to about 50 percent by weight based on total weight of the composition.
13. A composite or a laminate article made from the composition of claim 8 .
14. A curable resin composition for composites and electrical laminates comprising (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material;
wherein the at least one thermoset resin of component (I) comprises a diglycidyl ether of a dihydroxydiphenyl-cycloalkane compound; and wherein the dihydroxydiphenyl-cycloalkane compound comprises a dihydroxydiphenyl-cycloalkane compound represented by the following general Formula IV:
wherein R 1 and R 2 , independently from each other, each represents a hydrogen atom, a halogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted aralkyl group; X is CH 2 , CH(R 3 ), or C(R 3 )(R 4 ); m is an integral number between 8 and 20; and R 3 and R 4 , independently from each other, each represents a hydrogen atom, a halogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted aralkyl group.
15. The composition of claim 14 , wherein the dihydroxydiphenyl-cycloalkane compound is made from a cycloalkane compound containing from about C8 to about C20 carbon atoms.
16. The composition of claim 15 , wherein the cycloalkane compound is selected from the group consisting of cyclooctanone, cyclodecanone, cyclododecanone, cyclopentadecanone, cyclooctadecanone, cycloeicosanone, and mixtures thereof.
17. The composition of claim 16 , wherein cycloalkane compound comprises a bisphenol cyclododecanone.