Set-top box having microperforations
View Patent ↗The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking element over the circuit board and in thermal contact with the heatsink.
1. An electronic device comprising:
an outer casing having a top and a bottom, said outer casing having heat venting perforations;
a bottom frame inside said outer casing, said bottom frame having a heatsink surrounded by a peripheral area;
an interior electronic component over the bottom frame; and
a heatsinking element over the interior electronic component, said heatsinking element having a central region in thermal contact with the heatsink and having a peripheral portion, said peripheral portion having louvers, wherein said heatsinking element is under the top.
2. The electronic device of claim 1 wherein the perforations have an opening dimension of at most 1 mm.
3. The electronic device of claim 1 wherein the perforations have an opening dimensions within the range of 0.5 to 1 mm.
4. The electronic device of claim 1 wherein the heatsink is raised with respect to the peripheral area.
5. The electronic device of claim 4 wherein the central region is depressed with respect to the peripheral portion.
6. The electronic device of claim 5 wherein the perforations have an opening size of no greater than 1 mm.
7. The electronic device of claim 5 wherein the perforations have an opening size in the range of 0.5 to 1 mm.
8. The electronic device of claim 5 wherein there are at least four louvers of the louvers oriented each oriented in different directions.
9. The electronic device of claim 8 wherein the perforations have an opening dimensions within the range of 0.5 to 1 mm.
10. The electronic device of claim 5 further comprising a base stand, wherein a sidewall of the bottom frame is positioned in the stand such that the top and the bottom of the outer casing are oriented vertically.
11. The electronic device of claim 10 wherein the perforations have an opening dimensions within the range of 0.5 to 1 mm.
12. The electronic device of claim 1 wherein the central region is depressed with respect to the peripheral portion.
13. The electronic device of claim 1 wherein the interior electronic component is a circuit board and has a thermal contact region that permits the heatsink and central region to be in thermal contact.
14. The electronic device of claim 1 wherein at least one louver of the louvers is oriented in one direction and at least one other louver of the louvers is oriented in another direction.
15. The electronic device of claim 1 wherein the peripheral area has at least one aperture.
16. The electronic device of claim 1 wherein
the bottom frame has two opposing sidewalls each having openings and clasps adjacent said openings; and
the electronic device further comprises end caps having engagement members that engage the clasps through said openings, thereby locking the end caps to the bottom frame.
17. The electronic device of claim 16 wherein
the clasps are narrower than the engagement members along a vertical dimension; and
the bottom frame has a rear wall having unlocking apertures adapted to permit unlocking prongs to enter therethrough and release the engagement members from the clasps, thereby permitting the ends caps to be unlocked from the bottom frame.
18. The electronic device of claim 17 wherein there are at least four louvers of the louvers oriented each in different directions.
19. The electronic device of claim 17 wherein the electronic device has no fan.
20. The electronic device of claim 1 wherein there are at least four louvers of the louvers oriented each in different directions.